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EXB-D10C684J
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EXB-D10C684J Description
EXB-D10C684J Description
The EXB-D10C684J from Panasonic Electronic Components is a high-performance 8-resistor bussed network designed for precision surface-mount applications. Housed in a compact 1206 (3216 Metric) concave long-side terminal package, this device features a 680kΩ resistance per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient. Its 50mW power rating per element and low-profile 0.026" (0.65mm) height make it ideal for space-constrained designs. Compliant with ROHS3 and REACH standards, this resistor array is supplied in tape & reel (TR) packaging, ensuring compatibility with automated assembly processes.
EXB-D10C684J Features
- 8-resistor bussed network in a single 1206 footprint, reducing PCB space and assembly complexity.
- Concave long-side terminals enhance solder joint reliability and mechanical stability.
- Wide operating range with a ±200ppm/°C temperature coefficient, suitable for stable performance across varying environments.
- 50mW power dissipation per resistor, balancing compact size with robust power handling.
- Moisture Sensitivity Level (MSL) 1 (Unlimited), allowing extended storage without baking requirements.
- ROHS3 and REACH compliant, meeting stringent environmental and safety standards.
EXB-D10C684J Applications
This resistor array is optimized for applications requiring high-density, reliable resistance networks, including:
- Voltage division and pull-up/pull-down circuits in digital systems.
- Signal conditioning and impedance matching in communication devices.
- Power supply decoupling and filtering in industrial and automotive electronics.
- Sensor interface circuits where consistent resistance values are critical.
Its bussed configuration simplifies PCB layout, while the 1206 package ensures compatibility with standard SMT processes.
Conclusion of EXB-D10C684J
The Panasonic EXB-D10C684J resistor network combines compact design, high reliability, and ease of integration, making it a superior choice for modern electronics. Its optimized thermal performance, robust construction, and compliance with environmental standards position it as an ideal solution for automotive, industrial, and consumer applications where space efficiency and durability are paramount. Engineers can leverage its bussed architecture to streamline designs while maintaining precision and performance.



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