Panasonic

EXB-E10C561J

EXB-E10C561J Description

The EXB-E10C561J from Panasonic Electronic Components is a high-performance 8-resistor bussed network designed for surface-mount applications. This 1608 package (4.00mm x 2.10mm) device features a 560Ω resistance per element with a ±5% tolerance, making it ideal for precision circuit designs. With a 62.5mW power rating per resistor and a ±200ppm/°C temperature coefficient, it ensures stable performance across varying thermal conditions. The concave, long-side terminal design enhances solderability and mechanical stability, while its ROHS3 compliance and REACH unaffected status meet stringent environmental standards. Packaged in Tape & Reel (TR), it is optimized for automated assembly processes.

EXB-E10C561J Features

• Compact 1608 Package: Space-saving 0.157" x 0.083" (4.00mm x 2.10mm) footprint with a low profile (0.026" height).
• Bussed Circuit Configuration: Simplifies PCB layout by connecting resistors in a single network.
• High Reliability: Moisture Sensitivity Level (MSL) 1 (Unlimited) ensures durability in humid environments.
• Wide Operating Range: ±200ppm/°C temperature coefficient for consistent performance in industrial and automotive applications.
• Automation-Ready: Supplied in Tape & Reel (TR) for efficient pick-and-place assembly.

EXB-E10C561J Applications

This resistor array excels in:

• Voltage Division Circuits: Precision dividers in sensor interfaces or ADC reference networks.
• Pull-Up/Pull-Down Networks: Simplifies biasing for microcontrollers and digital ICs.
• Consumer Electronics: Dense PCB designs in smartphones, tablets, and wearables.
• Industrial Control Systems: Stable performance in PLCs, motor drives, and power supplies.
• Automotive Electronics: Reliable operation in infotainment and ECU modules.

Conclusion of EXB-E10C561J

The EXB-E10C561J combines miniaturization, reliability, and ease of integration, making it a superior choice for modern electronics. Its bussed architecture, robust construction, and compliance with environmental regulations position it as a versatile solution for both high-volume manufacturing and precision applications. Engineers can leverage its low-profile design and thermal stability to optimize space-constrained or thermally challenging designs.