Panasonic Tariff Inquiry

EXB-E10C750J

EXB-E10C750J Description

The EXB-E10C750J from Panasonic Electronic Components is a high-performance 8-resistor bussed network designed for precision surface-mount applications. Encased in a compact 1608 (4.00mm x 2.10mm) concave package with long-side terminals, this array offers a 75Ω resistance per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient. Rated for 63mW power per element, it operates reliably under a wide temperature range, making it suitable for demanding electronic circuits. Compliant with ROHS3 and REACH standards, the EXB-E10C750J is delivered in tape & reel (TR) packaging, ensuring compatibility with automated assembly processes. Its Moisture Sensitivity Level (MSL) 1 rating guarantees unlimited shelf life and ease of handling.

EXB-E10C750J Features

• Compact Design: Ultra-low profile (0.65mm height) and 1608 footprint save PCB space.
• Bussed Circuit: Simplified routing with all resistors connected to a common node, reducing design complexity.
• High Reliability: ±200ppm/°C TCR ensures stable performance across temperature variations.
• Automation-Friendly: Tape & reel packaging and 10-pin configuration streamline high-volume production.
• Broad Compliance: Meets ROHS3, REACH, and ECCN EAR99 requirements for global deployment.
• Low Power Dissipation: 63mW per element balances efficiency with thermal management.

EXB-E10C750J Applications

Ideal for space-constrained and high-density PCB designs, the EXB-E10C750J excels in:

• Consumer Electronics: Voltage division, pull-up/down networks in smartphones, wearables.
• Industrial Controls: Signal conditioning, termination resistors in PLCs and sensors.
• Automotive Systems: ECU circuits where temperature stability and compactness are critical.
• Telecom Infrastructure: Impedance matching in RF modules and baseband units.
• Medical Devices: Precision analog circuits requiring stable resistance values.

Conclusion of EXB-E10C750J

The Panasonic EXB-E10C750J resistor network stands out for its miniaturized form factor, robust performance, and ease of integration. Its bussed architecture and high tolerance make it a versatile choice for modern electronics, particularly where board real estate and reliability are paramount. Whether in consumer, industrial, or automotive applications, this component delivers consistent performance while adhering to stringent environmental and regulatory standards.