Renesas Electronics Corporation_F0110NBTI
original

Renesas Electronics Corporation
F0110NBTI

860-F0110NBTI
PDF Datasheet
F0110 DUAL LNA
18 Weeks

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
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Tech Specifications

ECCN
EAR99
Mounting Type
Surface Mount
Current - Supply
110mA
Product Status
Active
Supplier Device Package
16-VFQFPN (4x4)
Series
F0110
Package / Case
16-WQFN Exposed Pad
Voltage - Supply
4.75V ~ 5.25V
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F0110NBTI Description

With a vision to drive innovation and transform industries, the Tray in this F0110NBTI plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Renesas Electronics Corporation is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Renesas Electronics Corporation F0110NBTI falls into the RF Amplifiers which is a subset of RF and Wireless. This F0110NBTI ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

What package or case is F0110NBTI available in?
F0110NBTI is available in the 16-WQFN Exposed Pad package / case.
What is F0110NBTI?
What is the mounting type of F0110NBTI?
What operating temperature range does F0110NBTI support?
Are there related or alternative parts for F0110NBTI?
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