Renesas Electronics Corporation

R1RW0416DSB-2PR#S1

R1RW0416DSB-2PR#S1 Description

The R1RW0416DSB-2PR#S1 is an asynchronous 4M Fast SRAM (Static Random Access Memory) memory IC chip manufactured by Renesas Electronics Corporation. This memory chip is designed for high-performance applications requiring fast data access and reliable performance. It features a parallel memory interface and a memory organization of 256K x 16, providing a total memory size of 4Mbit. The chip operates within a supply voltage range of 3V to 3.6V and supports an operating temperature range of 0°C to 70°C (TA). With an access time of 12 ns and a write cycle time of 12 ns for both word and page, the R1RW0416DSB-2PR#S1 ensures rapid data read and write operations. The memory type is volatile, meaning it retains data only while power is supplied. The chip is packaged in a surface mount format and is available in tape and reel (TR) packaging, making it suitable for automated assembly processes. The R1RW0416DSB-2PR#S1 is RoHS3 compliant and has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before assembly.

R1RW0416DSB-2PR#S1 Features

• High-Speed Performance: With an access time of 12 ns and a write cycle time of 12 ns, the R1RW0416DSB-2PR#S1 delivers rapid data access and write capabilities, making it ideal for applications requiring quick data processing.
• Robust Memory Organization: The 256K x 16 memory organization provides a total memory size of 4Mbit, offering ample storage for various applications while maintaining efficient data management.
• Wide Operating Temperature Range: The chip operates reliably within a temperature range of 0°C to 70°C (TA), ensuring stable performance in diverse environmental conditions.
• Flexible Supply Voltage: The R1RW0416DSB-2PR#S1 supports a supply voltage range of 3V to 3.6V, providing flexibility in power supply requirements.
• Surface Mount Compatibility: The surface mount mounting type and tape and reel (TR) packaging make the chip suitable for automated assembly processes, enhancing production efficiency.
• Environmental Compliance: The chip is RoHS3 compliant, meeting stringent environmental standards and ensuring safe usage in various industries.
• Moisture Sensitivity Level (MSL) 3: The MSL 3 rating allows for 168 hours of exposure before assembly, providing flexibility in manufacturing processes.

R1RW0416DSB-2PR#S1 Applications

The R1RW0416DSB-2PR#S1 is well-suited for a variety of high-performance applications, including:

• Embedded Systems: Ideal for use in embedded systems requiring fast data access and reliable performance, such as industrial control systems, automotive electronics, and IoT devices.
• Networking Equipment: Suitable for networking applications where rapid data handling and low latency are critical, such as routers, switches, and network interface cards.
• Consumer Electronics: Enhances the performance of consumer electronics by providing fast and efficient memory solutions, such as gaming consoles, digital cameras, and smart TVs.
• Medical Devices: Ensures reliable and fast data processing in medical devices, contributing to accurate diagnostics and efficient operation.
• Telecommunications: Supports high-speed data transmission and processing in telecommunications infrastructure, including base stations and signal processing units.

Conclusion of R1RW0416DSB-2PR#S1

The R1RW0416DSB-2PR#S1 asynchronous 4M Fast SRAM memory IC chip from Renesas Electronics Corporation stands out for its high-speed performance, robust memory organization, and wide operating temperature range. Its compliance with RoHS3 standards and MSL 3 rating ensures environmental safety and manufacturing flexibility. The chip's surface mount compatibility and tape and reel packaging make it ideal for automated assembly processes, enhancing production efficiency. With its fast access and write cycle times, the R1RW0416DSB-2PR#S1 is a reliable choice for a wide range of high-performance applications, including embedded systems, networking equipment, consumer electronics, medical devices, and telecommunications.