Renesas Electronics Corporation_R5F5631BCDFB#V0

Renesas Electronics Corporation
R5F5631BCDFB#V0  
Microcontrollers

R5F5631BCDFB#V0
685-R5F5631BCDFB#V0
Ersa
Renesas Electronics Corporation-R5F5631BCDFB#V0-datasheets-4486289.pdf
IC MCU 32BIT 1MB FLASH 144LQFP
In Stock : 687

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R5F5631BCDFB#V0 Description

The Renesas Electronics Corporation's R5F5631BCDFB#V0 is a high-performance microcontroller unit (MCU) designed for a wide range of applications. Here is a description of the model, its features, and potential applications:

Model Description:

The R5F5631BCDFB#V0 is a member of the Renesas 16-bit microcontroller family, specifically designed for embedded systems that require high-speed processing and low power consumption. It is built on advanced semiconductor technology and is equipped with a range of integrated peripherals to support various functionalities.

Features:

  1. Processor: It features a high-speed CPU capable of executing complex instructions quickly, which is essential for real-time processing in embedded systems.

  2. Memory: The MCU includes a generous amount of on-chip memory, including both ROM and RAM, allowing for the storage of program code and data within the device itself.

  3. Peripherals: It comes with a variety of integrated peripherals such as UARTs for serial communication, timers, ADCs for analog-to-digital conversion, and PWM channels for motor control or signal generation.

  4. Low Power Consumption: Designed with low-power modes to extend battery life in portable applications.

  5. Security Features: It may include features like secure boot and encrypted memory to protect against unauthorized access and tampering.

  6. Connectivity: Depending on the model, it may support various communication protocols such as USB, Ethernet, or wireless interfaces for easy integration into networked systems.

  7. Programmability: It is typically programmed using C or assembly language and can be developed using a range of development tools and integrated development environments (IDEs) provided by Renesas.

  8. Package Type: The "BCDFB" in the model number often refers to the package type, which could be a ball grid array (BGA) package suitable for surface-mount technology (SMT) in printed circuit board (PCB) assembly.

Applications:

  1. Automotive Systems: Used in engine control units, body control modules, and infotainment systems due to their real-time processing capabilities and robustness.

  2. Industrial Control: Ideal for control systems in manufacturing, robotics, and automation where precise control and real-time monitoring are required.

  3. Medical Devices: Can be found in medical equipment that requires reliable and precise operation, such as diagnostic equipment and portable medical devices.

  4. Consumer Electronics: Suitable for use in home appliances, smart devices, and IoT (Internet of Things) applications where connectivity and user interactivity are important.

  5. Telecommunications: Can be used in modems, routers, and other network equipment that require high-speed data processing and secure communication.

  6. Power Management: Utilized in systems that require efficient power usage, such as battery management systems and energy monitoring devices.

It's important to note that the specific features and capabilities can vary between different products from Renesas, and the actual applications will depend on the design requirements of the system in which the MCU is used. Always refer to the datasheet and product documentation for detailed specifications and application notes.

Tech Specifications

Core Processor
Program Memory Type
Product Status
Supplier Device Package
EEPROM Size
Package / Case
REACH Status
Mfr
Voltage - Supply (Vcc/Vdd)
RoHS Status
Moisture Sensitivity Level (MSL)
Speed
Operating Temperature
RAM Size
ECCN
Number of I/O
Peripherals
Mounting Type
Oscillator Type
Series
Core Size
Connectivity
Program Memory Size
HTSUS
Package
Data Converters
Base Product Number
Unit Weight
Product
ADC Resolution
RoHS
Supply Voltage - Min
Processor Series
Data RAM Type
Maximum Clock Frequency
Height
Maximum Operating Temperature
Supply Voltage - Max
Width
Data RAM Size
Interface Type
Core
Mounting Style
Watchdog Timers
Data Bus Width
Minimum Operating Temperature
Moisture Sensitive
Length
Number of I/Os
USHTS

R5F5631BCDFB#V0 Documents

Download datasheets and manufacturer documentation for R5F5631BCDFB#V0

Ersa Mult Dev Pkg Chgs 1/Jul/2020      
Ersa Additional Wafer Fab Site 18/Apr/2016      
Ersa RX63N, RX631 Group Datasheet      
Ersa Label Change-All Devices 01/Dec/2022       Carrier Tape Update 29/Jul/2016      
Ersa RX63N, RX631 Hrdw Manual      
Ersa RX62yy Bondwire Material Chg 15/Aug/2017      

Shopping Guide

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