Renesas Electronics Corporation

UPD70F3757GJ-GAE-AX  

Microcontrollers

UPD70F3757GJ-GAE-AX is a high-performance, high-density System-in-Package (SiP) solution from Renesas Electronics Corporation. This advanced device combines a microcontroller, power management, and various interfaces in a compact package, making it ideal for a wide range of applications in the industrial, automotive, and consumer electronics markets.

Description:

The UPD70F3757GJ-GAE-AX is a System-in-Package (SiP) device that integrates multiple components and functions into a single package. It features a high-performance microcontroller, power management circuits, and various interfaces, all housed in a compact and robust package. This SiP solution is designed to provide a cost-effective and efficient solution for various applications.

Features:

1. High-performance microcontroller: The UPD70F3757GJ-GAE-AX features a powerful microcontroller that can handle complex tasks and processes with ease.
2. Integrated power management: The device includes on-chip power management circuits that help optimize power consumption and ensure efficient operation.
3. Multiple interfaces: The SiP solution offers a range of interfaces, including UART, SPI, I2C, and CAN, allowing for seamless communication with various peripherals and external devices.
4. Compact and robust package: The UPD70F3757GJ-GAE-AX is housed in a compact and robust package, making it suitable for use in a wide range of applications and environments.
5. Wide operating temperature range: The device can operate in a wide temperature range, making it suitable for use in harsh environments and applications with extreme temperature fluctuations.

Applications:

1. Industrial control systems: The UPD70F3757GJ-GAE-AX can be used in industrial control systems for tasks such as motor control, sensor interfacing, and data acquisition.
2. Automotive applications: The device is suitable for various automotive applications, including infotainment systems, body control modules, and powertrain control.
3. Consumer electronics: The UPD70F3757GJ-GAE-AX can be used in consumer electronics devices such as smart home appliances, wearable devices, and portable electronics.
4. IoT devices: The SiP solution is ideal for Internet of Things (IoT) devices, providing the necessary processing power, connectivity, and power management for efficient operation.
5. Medical devices: The UPD70F3757GJ-GAE-AX can be used in medical devices for tasks such as patient monitoring, diagnostics, and control of medical equipment.

In summary, the UPD70F3757GJ-GAE-AX from Renesas Electronics Corporation is a versatile and high-performance System-in-Package (SiP) solution that combines a microcontroller, power management, and various interfaces in a compact package. It is suitable for a wide range of applications in the industrial, automotive, consumer electronics, IoT, and medical device markets.

UPD70F3757GJ-GAE-AX Documents

Download datasheets and manufacturer documentation for UPD70F3757GJ-GAE-AX

Datasheets :

uPD70F3747-57      

PCN Packaging :

Label Change-All Devices 01/Dec/2022      

PCN Obsolescence/ EOL :

EOL 15/Jun/2023