Renesas Electronics Corporation_ZSSC3123AI6C
Renesas Electronics Corporation_ZSSC3123AI6C
original

Renesas Electronics Corporation
ZSSC3123AI6C

752-ZSSC3123AI6C
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DICE (WAFER SAWN) - FRAME
24 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C (TA)
Input Type
Capacitive
Output Type
I2C, SPI
Grade
-
Mounting Type
Surface Mount
Current - Supply
1.1 mA
Product Status
Active
Supplier Device Package
Die
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ZSSC3123AI6C Description

The Tray for this electronic equipment is available. The packaging way of this ZSSC3123AI6C is to conserve time, space, energy, and resources. This ZSSC3123AI6C offers cheap cost, adaptability, dependability, efficiency, and consistency. This ZSSC3123AI6C is produced by Renesas Electronics Corporation and is used in a variety of industries. This manufacturer aspires to rank among the top electronic vendors in the Asia-Pacific region. Additionally, it hopes to contribute significantly to the sector's expansion. This ZSSC3123AI6C falls under the Sensor and Detector Interfaces category. The most advanced level of this category is Interface IC Chips. IC interfaces differ in terms of device types and applications. Some products are used with buffers, cardbus controllers, and crosspoint switches.

FAQ

What voltage specification is listed for ZSSC3123AI6C?
The listed voltage-related specification for ZSSC3123AI6C is 2.3 V.
What package or case is ZSSC3123AI6C available in?
What operating temperature range does ZSSC3123AI6C support?
What is the standard lead time for ZSSC3123AI6C?
What is ZSSC3123AI6C?
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