ROHM Semiconductor

BD8166EFV-E2  

Specialized Power Management

This electronic device regards Tape & Reel (TR) method as the top priority. This BD8166EFV-E2 packaging method makes it simple and quick to package big quantities of powdered commodities. This BD8166EFV-E2 is produced by this ROHM Semiconductor in order to provide enough products to meet consumers’ demand. The blueprint of this ROHM Semiconductor is to keep pace with the growth of world’s leading level of science and technology. This BD8166EFV-E2 belongs to Specialized Power Management category. It’s previous category pertains to Power Management (PMIC). Complete power supply systems can be implemented using Power Management Integrated Circuits (PMICs). It combines several voltage regulators and control circuits onto a single chip. They simplify and cost-effectively manage system power management while reducing component count and board area. This BD8166EFV-E2 is a great fit for embedded processing in a variety of applications. They are includes edge computing, the Internet of Things (IoT), industrial and medical IoT, electric vehicles (EVs), and autonomous cars.

BD8166EFV-E2 Documents

Download datasheets and manufacturer documentation for BD8166EFV-E2

Datasheets :

HTSSOP-B40 Taping Spec       BD8166EFV-E2      

Other Related Documents :

BD8166EFV-E2 Flammability      

HTML Datasheet :

HTSSOP-B40 Taping Spec       BD8166EFV      

Environmental Information :

BD8166EFV-E2 Whisker Info