ROHM Semiconductor_BD88030FV-E2
original

ROHM Semiconductor
BD88030FV-E2

686-BD88030FV-E2
PDF Datasheet
IC INTERFACE SYSTEM 16SSOP
20 Weeks

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Tech Specifications

Manufacturer
Rohm Semiconductor
Series
-
Packaging
Tape & Reel (TR)
Part Status
Active
Type
Interface System
Applications
-
Mounting Type
Surface Mount
Package / Case
16-LSSOP (0.173", 4.40mm Width)
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BD88030FV-E2 Description

BD88030FV-E2 Description

The BD88030FV-E2 is an advanced interface system IC designed by Rohm Semiconductor. This specialized IC is part of the BD88030 family and is packaged in a 16-lead small outline package (16SSOP), making it ideal for surface mount applications. The device is available in a tape and reel (TR) format, which is suitable for automated assembly processes. The BD88003FV-E2 is an active product, ensuring that it meets the latest industry standards and is ready for integration into modern electronic systems.

BD88030FV-E2 Features

The BD88030FV-E2 offers several unique features that set it apart from similar interface system ICs. Key technical specifications include:

  • Package Type: 16SSOP, which provides a compact footprint suitable for space-constrained applications.
  • Mounting Type: Surface Mount, allowing for efficient and reliable integration into printed circuit boards (PCBs).
  • Moisture Sensitivity Level (MSL): Level 1 (Unlimited), indicating that the IC can be safely stored and handled without the need for moisture protection, simplifying the manufacturing process.
  • Manufacturer: Rohm Semiconductor, a renowned name in the semiconductor industry, known for its high-quality and reliable products.
  • Product Status: Active, ensuring that the BD88030FV-E2 is up-to-date with the latest technological advancements and is supported by the manufacturer.

BD88030FV-E2 Applications

The BD88030FV-E2 is designed to meet the demands of various specialized applications. Its versatility and robust performance make it suitable for:

  • Consumer Electronics: Ideal for devices requiring compact and reliable interface solutions, such as smartphones, tablets, and wearable technology.
  • Automotive Systems: Suitable for automotive applications where surface mount technology and moisture resistance are critical.
  • Industrial Equipment: Perfect for industrial control systems that require high reliability and efficient integration.
  • Medical Devices: Applicable in medical equipment where compact size and high performance are essential.

Conclusion of BD88030FV-E2

The BD88030FV-E2 from Rohm Semiconductor is a highly versatile and reliable interface system IC. Its compact 16SSOP package, surface mount compatibility, and moisture resistance make it an excellent choice for a wide range of applications. The active product status ensures that it is supported by the manufacturer, providing confidence in its long-term availability and performance. Whether used in consumer electronics, automotive systems, industrial equipment, or medical devices, the BD88030FV-E2 offers a robust and efficient solution for modern electronic designs.

FAQ

What is the standard lead time for BD88030FV-E2?
The standard lead time for BD88030FV-E2 is 20 Weeks.
What is BD88030FV-E2?
What package or case is BD88030FV-E2 available in?
What is the mounting type of BD88030FV-E2?
Are there related or alternative parts for BD88030FV-E2?
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