ROHM Semiconductor_BR24G08FVJ-3GTE2
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ROHM Semiconductor
BR24G08FVJ-3GTE2

774-BR24G08FVJ-3GTE2
PDF Datasheet
IC EEPROM 8KBIT I2C 8TSSOP
13 Weeks

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Tech Specifications

Clock Frequency
400 kHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
I2C
ECCN
EAR99
Memory Organization
1K x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Not For New Designs
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BR24G08FVJ-3GTE2 Description

BR24G08FVJ-3GTE2 Description

The BR24G08FVJ-3GTE2 is a high-performance 8Kbit EEPROM memory IC chip designed by Rohm Semiconductor. This chip is ideal for a wide range of applications requiring reliable and efficient data storage solutions. The BR24G08FVJ-3GTE2 features a 1K x 8 memory organization, providing a total memory size of 8Kbit. It operates with a clock frequency of 400 kHz and utilizes an I2C memory interface, ensuring fast and reliable data transfer. The chip is designed for surface mount applications and comes in an 8TSSOP package, making it suitable for compact and space-constrained designs.

BR24G08FVJ-3GTE2 Features

  • Memory Size and Organization: The BR24G08FVJ-3GTE2 offers a memory size of 8Kbit, organized in a 1K x 8 format. This configuration provides a balance between memory capacity and addressability, making it suitable for various embedded systems and IoT applications.
  • Clock Frequency: With a clock frequency of 400 kHz, the chip ensures efficient data transfer rates, which is crucial for applications requiring quick read and write operations.
  • Memory Interface: The I2C interface simplifies communication with microcontrollers and other system components, reducing the complexity of the overall design.
  • Write Cycle Time: The BR24G08FVJ-3GTE2 has a write cycle time of 5ms for both word and page operations, ensuring quick data storage and retrieval.
  • Voltage Range: The chip operates within a voltage range of 1.6V to 5.5V, providing flexibility and compatibility with a variety of power supply configurations.
  • Compliance and Standards: The BR24G08FVJ-3GTE2 is REACH unaffected and ROHS3 compliant, ensuring it meets the latest environmental and safety standards. It also has a moisture sensitivity level (MSL) of 1, making it suitable for a wide range of manufacturing environments.
  • Packaging: The chip is available in a Tape & Reel (TR) package, which is ideal for automated assembly processes and ensures consistent and reliable component placement.

BR24G08FVJ-3GTE2 Applications

The BR24G08FVJ-3GTE2 is well-suited for a variety of applications, including:

  • Embedded Systems: Ideal for microcontroller-based systems where reliable and efficient data storage is required.
  • IoT Devices: Provides a compact and efficient memory solution for IoT devices that need to store configuration data or sensor readings.
  • Consumer Electronics: Suitable for applications such as smart home devices, wearables, and other consumer electronics where space is limited but reliable memory is essential.
  • Industrial Automation: Can be used in industrial control systems for storing calibration data, system parameters, and other critical information.

Conclusion of BR24G08FVJ-3GTE2

The BR24G08FVJ-3GTE2 from Rohm Semiconductor is a robust and versatile EEPROM memory IC chip that offers a balance of performance, reliability, and compatibility. Its 8Kbit memory size, I2C interface, and 400 kHz clock frequency make it suitable for a wide range of applications, from embedded systems to IoT devices. The chip's compliance with environmental and safety standards, along with its surface mount design and Tape & Reel packaging, ensures it is ready for modern manufacturing processes. While it is marked as "Not For New Designs," the BR24G08FVJ-3GTE2 remains a reliable choice for existing designs and applications that require a proven and efficient memory solution.

FAQ

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