ROHM Semiconductor_BU24035GW-E2
original

ROHM Semiconductor
BU24035GW-E2

744-BU24035GW-E2
PDF Datasheet
IC MTR DRV BIPLR 2.7-3.6V 75UCSP
20 Weeks

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Tech Specifications

Current - Output
500mA, 600mA
Output Configuration
Half Bridge (12)
Product Status
Active
Supplier Device Package
40-UCSP75M3 (3.1x3.1)
Function
Driver - Fully Integrated, Control and Power Stage
Package / Case
40-VFBGA, CSPBGA
Technology
Power MOSFET
Step Resolution
>256 Microsteps
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BU24035GW-E2 Description

This electronic device regards Tape & Reel (TR) method as the top priority. This BU24035GW-E2 packaging method makes it simple and quick to package big quantities of powdered commodities. This BU24035GW-E2 is produced by this ROHM Semiconductor in order to provide enough products to meet consumers’ demand. The blueprint of this ROHM Semiconductor is to keep pace with the growth of world’s leading level of science and technology. This BU24035GW-E2 belongs to Motor Drivers, Controllers category. It’s previous category pertains to Power Management (PMIC). Complete power supply systems can be implemented using Power Management Integrated Circuits (PMICs). It combines several voltage regulators and control circuits onto a single chip. They simplify and cost-effectively manage system power management while reducing component count and board area. This BU24035GW-E2 is a great fit for embedded processing in a variety of applications. They are includes edge computing, the Internet of Things (IoT), industrial and medical IoT, electric vehicles (EVs), and autonomous cars.

FAQ

What is the mounting type of BU24035GW-E2?
BU24035GW-E2 uses a Surface Mount mounting style based on the listed product specifications.
What package or case is BU24035GW-E2 available in?
What is BU24035GW-E2?
Are there related or alternative parts for BU24035GW-E2?
What is the standard lead time for BU24035GW-E2?
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