ROHM Semiconductor_BU8272GUW-E2
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ROHM Semiconductor
BU8272GUW-E2

749-BU8272GUW-E2
IC XPNDR 400KHZ I2C 35VBGA

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ISO9001
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ISO14001
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Tech Specifications

Clock Frequency
400 kHz
Operating Temperature
-25°C ~ 85°C
Output Type
Open Drain
ECCN
EAR99
Number of I/O
20
Current - Output Source/Sink
-
Mounting Type
Surface Mount
Product Status
Obsolete
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BU8272GUW-E2 Description

BU8272GUW-E2 Description

The BU8272GUW-E2 is a 400 kHz I2C interface IC chip designed by ROHM Semiconductor, a leading manufacturer in the semiconductor industry. This chip is housed in a 35-pin VBGA035W040 package, making it suitable for surface mount applications. It features a clock frequency of 400 kHz, providing efficient data transfer rates for various electronic systems. The chip operates within a supply voltage range of 1.65V to 1.95V, ensuring compatibility with low-power devices. It also supports an open-drain output type, which is beneficial for reducing power consumption and improving signal integrity.

BU8272GUW-E2 Features

  • Interface: The BU8272GUW-E2 supports the I2C interface, a widely used serial communication protocol known for its simplicity and reliability. This makes it ideal for applications requiring minimal wiring and easy integration.
  • Clock Frequency: With a clock frequency of 400 kHz, this chip ensures fast and efficient data transfer, making it suitable for applications requiring high-speed communication.
  • Output Type: The open-drain output type allows for multiple devices to share the same bus, reducing the number of required connections and simplifying the overall system design.
  • Interrupt Output: The chip features an interrupt output, enabling it to signal the host microcontroller or processor when data is ready or an error occurs, enhancing system responsiveness and efficiency.
  • Power Supply: The operating voltage range of 1.65V to 1.95V ensures compatibility with low-power devices, making it suitable for battery-operated or energy-efficient systems.
  • Number of I/O: With 20 I/O pins, the BU8272GUW-E2 offers ample connectivity options for interfacing with various sensors, actuators, and other peripherals.
  • Package: The VBGA035W040 package is designed for surface mount technology (SMT), providing a compact and reliable solution for modern electronic designs.
  • Compliance: The chip is REACH unaffected and RoHS3 compliant, ensuring it meets the latest environmental and safety standards, making it suitable for use in a wide range of industries.

BU8272GUW-E2 Applications

The BU8272GUW-E2 is ideal for a variety of applications due to its versatile features and compatibility with low-power systems. Some specific use cases include:

  • Consumer Electronics: In devices such as smartphones, tablets, and wearables, where low power consumption and compact design are crucial.
  • Industrial Automation: For interfacing with sensors and actuators in industrial control systems, where reliable communication and minimal wiring are essential.
  • Automotive Electronics: In vehicle infotainment systems and advanced driver-assistance systems (ADAS), where high-speed data transfer and low power consumption are required.
  • Medical Devices: For applications such as portable medical monitors and diagnostic equipment, where reliability and low power consumption are paramount.

Conclusion of BU8272GUW-E2

The BU8272GUW-E2 from ROHM Semiconductor is a robust and versatile I2C interface IC chip that offers a range of features and benefits suitable for various electronic applications. Its high-speed data transfer capabilities, open-drain output, and low-power operation make it an excellent choice for modern electronic designs. Additionally, its compliance with environmental and safety standards ensures it meets the requirements of a wide range of industries. Despite being marked as obsolete, the BU8272GUW-E2 remains a reliable and efficient solution for applications requiring a compact, low-power I2C interface.

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