ROHM Semiconductor_BU8763FV-E2
original

ROHM Semiconductor
BU8763FV-E2

702-BU8763FV-E2
PDF Datasheet
IC TELECOM INTERFACE SSOP-B16
15 Weeks

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Tech Specifications

Operating Temperature
-20°C ~ 70°C
ECCN
EAR99
Mounting Type
Surface Mount
Current - Supply
-
Product Status
Active
Supplier Device Package
16-SSOP-B
Series
-
Function
Melody LSI
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BU8763FV-E2 Description

The Tape & Reel (TR) for this electronic equipment is available. The packaging way of this BU8763FV-E2 is to conserve time, space, energy, and resources. This BU8763FV-E2 offers cheap cost, adaptability, dependability, efficiency, and consistency. This BU8763FV-E2 is produced by ROHM Semiconductor and is used in a variety of industries. This manufacturer aspires to rank among the top electronic vendors in the Asia-Pacific region. Additionally, it hopes to contribute significantly to the sector's expansion. This BU8763FV-E2 falls under the Telecom category. The most advanced level of this category is Interface IC Chips. IC interfaces differ in terms of device types and applications. Some products are used with buffers, cardbus controllers, and crosspoint switches.

FAQ

What is the mounting type of BU8763FV-E2?
BU8763FV-E2 uses a Surface Mount mounting style based on the listed product specifications.
What is the standard lead time for BU8763FV-E2?
What package or case is BU8763FV-E2 available in?
Does BU8763FV-E2 have quantity-based pricing?
What voltage specification is listed for BU8763FV-E2?
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