ROHM Semiconductor Tariff Inquiry

MCR006YZPJ220

MCR006YZPJ220 Description

The MCR006YZPJ220 from ROHM Semiconductor is a high-performance 22 Ohm, 5% tolerance thick film chip resistor designed for surface-mount (SMD) applications. Encased in an ultra-compact 0201 (0603 Metric) package measuring 0.024" x 0.012" (0.60mm x 0.30mm) with a low-profile height of 0.010" (0.26mm), this component is optimized for space-constrained PCB designs. It delivers a 0.05W (1/20W) power rating and operates with a ±250ppm/°C temperature coefficient, ensuring stable performance across varying thermal conditions. The resistor is RoHS3 compliant, REACH unaffected, and rated MSL 1 (Unlimited), making it suitable for automated assembly processes.

MCR006YZPJ220 Features

• Precision Resistance: 22Ω ±5% tolerance for reliable circuit performance.
• Miniaturized Form Factor: 0201 package ideal for high-density PCBs in portable and IoT devices.
• Robust Construction: Thick film technology enhances durability and longevity.
• Wide Thermal Stability: ±250ppm/°C coefficient ensures minimal resistance drift.
• Compliance: RoHS3, REACH, and ECCN EAR99 certified for global regulatory adherence.
• Automation-Friendly: Supplied in Tape & Reel (TR) packaging for efficient pick-and-place assembly.

MCR006YZPJ220 Applications

This resistor excels in applications demanding miniaturization and reliability, including:

• Consumer Electronics: Smartphones, wearables, and tablets where PCB space is critical.
• IoT & Sensor Modules: Low-power signal conditioning and voltage division circuits.
• Medical Devices: Compact diagnostic equipment requiring stable passive components.
• Automotive Electronics: Infotainment systems and ADAS modules (non-safety-critical).
• Industrial Controls: Precision instrumentation and embedded systems.

Conclusion of MCR006YZPJ220

The MCR006YZPJ220 stands out as a highly reliable, space-saving solution for modern electronics, combining precision, thermal stability, and compliance with industry standards. Its 0201 footprint and thick film construction make it a superior choice over larger or less stable alternatives, particularly in miniaturized, high-volume applications. Engineers and designers can leverage its low-profile, high-performance attributes to optimize circuit designs without compromising quality or regulatory requirements.