

ROHM Semiconductor
MNR14ERAPJ514
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MNR14ERAPJ514 Description
MNR14ERAPJ514 Description
The MNR14ERAPJ514 by ROHM Semiconductor is a high-performance 4-resistor array designed for precision surface-mount applications. This 1206 (3216 Metric) convex long-side terminal package offers a compact footprint of 0.126" x 0.063" (3.20mm x 1.60mm) with a low-profile height of 0.024" (0.60mm), making it ideal for space-constrained PCB designs. Each resistor in the array features a 510kΩ resistance with a ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The isolated circuit type and 62.5mW power rating per element enhance reliability in demanding circuits. Compliant with ROHS3 and REACH regulations, this component is suitable for global markets.
MNR14ERAPJ514 Features
- 4 isolated resistors in a single 1206 package, reducing board space and assembly complexity.
- Convex long-side terminals for improved solder joint reliability and mechanical stability.
- ±200ppm/°C TCR ensures minimal resistance drift over temperature fluctuations.
- 62.5mW power dissipation per resistor, suitable for low-power signal conditioning.
- MSL 1 (Unlimited) moisture sensitivity, allowing extended storage without baking.
- Tape & Reel (TR) packaging for automated pick-and-place assembly efficiency.
- ROHS3 and REACH compliant, meeting stringent environmental standards.
MNR14ERAPJ514 Applications
This resistor array excels in precision analog and digital circuits, including:
- Voltage dividers and pull-up/pull-down networks in microcontrollers and sensors.
- Signal conditioning for ADC/DAC interfaces, ensuring stable reference voltages.
- Consumer electronics, such as smart devices and wearables, where space efficiency is critical.
- Industrial control systems requiring robust, temperature-stable components.
- Automotive electronics (non-safety-critical) due to its reliability and compact form factor.
Conclusion of MNR14ERAPJ514
The MNR14ERAPJ514 combines high density, reliability, and performance in a single package, making it a superior choice for modern electronics. Its low TCR, compact design, and compliance with environmental standards position it as a versatile solution for both consumer and industrial applications. Engineers benefit from simplified assembly, reduced BOM complexity, and consistent performance, ensuring long-term system integrity.



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