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MNR15E0RPJ272

MNR15E0RPJ272 Description

The MNR15E0RPJ272 from ROHM Semiconductor is an 8-resistor bussed network array designed for high-density surface-mount applications. Packaged in a compact 1206 (3216 Metric) convex long-side terminal format, it offers a 2.7kΩ resistance per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient. The device operates at 31mW power per element, ensuring reliable performance in low-power circuits. Its 0.024" (0.60mm) seated height and 0.126" x 0.063" (3.20mm x 1.60mm) dimensions make it ideal for space-constrained designs. Compliant with ROHS3 and REACH standards, it is suitable for environmentally conscious applications.

MNR15E0RPJ272 Features

• 8-resistor bussed array simplifies circuit design by reducing component count.
• 1206 convex long-side terminal package enhances mechanical stability and solderability.
• ±5% tolerance and ±200ppm/°C TCR ensures consistent performance across temperature variations.
• 31mW power rating per resistor balances efficiency and thermal management.
• ROHS3 and REACH compliant, meeting global environmental regulations.
• Moisture Sensitivity Level (MSL) 1 allows unlimited floor life, reducing handling constraints.
• Tape & Reel (TR) packaging facilitates automated assembly processes.

MNR15E0RPJ272 Applications

This resistor network is ideal for:

• Voltage division and pull-up/down circuits in digital systems.
• Signal conditioning in sensor interfaces and ADC/DAC circuits.
• Consumer electronics, such as smartphones and wearables, where space and reliability are critical.
• Industrial control systems requiring stable resistance values under varying temperatures.
• Automotive electronics, leveraging its robust construction and environmental compliance.

Conclusion of MNR15E0RPJ272

The MNR15E0RPJ272 stands out for its compact design, reliable performance, and compliance with stringent environmental standards. Its bussed configuration and 1206 package make it a versatile choice for modern electronics, particularly in applications demanding miniaturization and repeatable performance. Engineers can leverage its low-profile, high-density layout to optimize board space while maintaining signal integrity.