

ROHM Semiconductor
MNR15ERRPJ151
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MNR15ERRPJ151 Description
MNR15ERRPJ151 Description
The MNR15ERRPJ151 from ROHM Semiconductor is an 8-resistor bussed network array designed for high-density PCB applications. Housed in a compact 1206 (3216 Metric) convex package with long-side terminals, it offers a 150Ω resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient. The device operates at 31mW power per resistor, ensuring reliable performance in low-power circuits. Its 0.026" (0.65mm) ultra-low profile and 3.20mm x 1.60mm footprint make it ideal for space-constrained designs. Compliant with ROHS3 and REACH standards, it features MSL 1 (Unlimited) moisture sensitivity, allowing extended shelf life and ease of handling. Packaged in Tape & Reel (TR), it is optimized for automated assembly processes.
MNR15ERRPJ151 Features
- 8-resistor bussed array simplifies circuit design by reducing component count.
- 150Ω ±5% tolerance ensures consistent performance across applications.
- 1206 convex package with long-side terminals enhances mechanical stability and solderability.
- ±200ppm/°C temperature coefficient provides stable resistance over a wide operating range.
- 31mW power rating per element suits low-power digital and analog circuits.
- ROHS3/REACH compliant and MSL 1 rated for environmental and reliability compliance.
- Compact 3.20mm x 1.60mm footprint saves board space versus discrete resistors.
MNR15ERRPJ151 Applications
This resistor network is ideal for:
- Pull-up/pull-down networks in microcontrollers and FPGAs.
- Voltage divider circuits in sensor interfaces and ADCs.
- Signal conditioning for industrial control systems.
- Consumer electronics, including smartphones and wearables, where space efficiency is critical.
- Automotive electronics, leveraging its robust construction and stable performance.
Conclusion of MNR15ERRPJ151
The MNR15ERRPJ151 combines high integration, reliability, and space-saving design, making it a superior choice for modern electronics. Its bussed architecture, low profile, and compliance with environmental standards position it as a versatile solution for both industrial and consumer applications. Engineers benefit from reduced BOM complexity and improved assembly efficiency, ensuring cost-effective and high-performance designs.



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