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MNR15ERRPJ272
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MNR15ERRPJ272 Description
MNR15ERRPJ272 Description
The MNR15ERRPJ272 from ROHM Semiconductor is a high-performance 8-resistor bussed network designed for precision surface-mount applications. Encased in a compact 1206 (3216 Metric) convex package with long-side terminals, this array integrates eight 2.7kΩ ±5% tolerance resistors, offering a ±200ppm/°C temperature coefficient for stable operation across varying thermal conditions. With a low-profile height of 0.026" (0.65mm) and dimensions of 3.20mm x 1.60mm, it optimizes PCB space while delivering 31mW power dissipation per element. Compliant with ROHS3 and REACH standards, it ensures environmental safety and reliability for modern electronics.
MNR15ERRPJ272 Features
- Bussed Circuit Configuration: Simplifies PCB layout by interconnecting resistors, reducing component count.
- 1206 Convex Package: Enhances mechanical stability and solder joint integrity with long-side terminals.
- Wide Operating Range: ±200ppm/°C thermal stability ensures consistent performance in industrial environments.
- High Power Handling: 31mW per resistor supports robust signal conditioning and voltage division.
- MSL 1 (Unlimited): Moisture-resistant packaging eliminates baking requirements before assembly.
- Tape & Reel (TR) Packaging: Enables automated pick-and-place manufacturing for high-volume production.
MNR15ERRPJ272 Applications
Ideal for space-constrained designs requiring multiple matched resistors, the MNR15ERRPJ272 excels in:
- Voltage Divider Networks: Precision attenuation in sensor interfaces and ADC circuits.
- Pull-Up/Pull-Down Arrays: Signal integrity maintenance in digital logic (e.g., I²C, SPI buses).
- Industrial Control Systems: Stable resistance in PLCs, motor drivers, and power management.
- Consumer Electronics: Dense PCBs in smart devices, wearables, and IoT modules.
- Automotive Electronics: Reliable performance in infotainment and ECU systems (meets AEC-Q200-like robustness).
Conclusion of MNR15ERRPJ272
The MNR15ERRPJ272 combines miniaturization, thermal stability, and manufacturing efficiency, making it a superior choice for engineers prioritizing reliability and space savings. Its bussed architecture reduces BOM complexity, while ROHS3/REACH compliance future-proofs designs. Whether for industrial automation or compact consumer gadgets, this resistor network delivers repeatable performance with the convenience of surface-mount integration.



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