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MNR15ERRPJ511
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MNR15ERRPJ511 Description
MNR15ERRPJ511 Description
The MNR15ERRPJ511 from ROHM Semiconductor is an 8-resistor bussed network array designed for high-density PCB applications. Housed in a compact 1206 (3216 Metric) convex package with long-side terminals, it offers a 510Ω resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient. The device operates at 31mW power per element and features a low-profile 0.026" (0.65mm) seated height, making it ideal for space-constrained designs. Compliant with ROHS3 and REACH standards, it is packaged in Tape & Reel (TR) for automated assembly efficiency.
MNR15ERRPJ511 Features
- Bussed Circuit Configuration: Simplifies layout by connecting resistors in a common-node topology, reducing component count.
- 1206 Convex Package: Long-side terminals enhance solder joint reliability and thermal performance.
- Wide Operating Range: Stable performance across industrial temperatures (±200ppm/°C).
- High Power Handling: 31mW per resistor ensures robustness in signal conditioning and pull-up/down applications.
- MSL 1 (Unlimited): No moisture sensitivity concerns, enabling extended storage and flexible manufacturing.
MNR15ERRPJ511 Applications
This resistor array excels in:
- Voltage Division Networks: Precision dividers in sensor interfaces or ADC circuits.
- Pull-Up/Pull-Down Resistor Arrays: Simplifying digital logic circuits (e.g., I²C buses).
- Consumer Electronics: Space-saving solution for smartphones, wearables, and IoT devices.
- Industrial PCBs: Reliable performance in harsh environments due to robust construction.
Conclusion of MNR15ERRPJ511
The MNR15ERRPJ511 combines miniaturization, reliability, and cost efficiency, making it a superior choice for modern electronics. Its bussed design reduces BOM complexity, while the 1206 convex package ensures mechanical stability. Ideal for high-volume production, this component meets stringent environmental standards without compromising performance. Engineers can leverage its low-profile, high-power characteristics for optimized designs in consumer, industrial, and automotive applications.



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