ROHM Semiconductor
MNR18E0APJ360
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MNR18E0APJ360 Description
MNR18E0APJ360 Description
The MNR18E0APJ360 from ROHM Semiconductor is an 8-resistor array designed for high-density surface-mount applications. This 1506 convex long-side terminal package (3.80mm x 1.60mm) offers a compact footprint with a low-profile height of 0.022" (0.55mm), making it ideal for space-constrained PCB designs. Each resistor in the array has a 36Ω resistance with a ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The isolated circuit configuration allows independent resistor operation, enhancing design flexibility.
MNR18E0APJ360 Features
- High-Density Integration: 8 resistors in a 16-pin 1506 package, optimizing board space.
- Robust Performance: 62.5mW power rating per element and ROHS3 compliance ensure reliability in demanding applications.
- Stable Thermal Characteristics: ±200ppm/°C TCR minimizes resistance drift under temperature fluctuations.
- MSL 1 (Unlimited): Suitable for extended storage and handling without moisture sensitivity concerns.
- Tape & Reel Packaging: Facilitates automated assembly processes, improving manufacturing efficiency.
MNR18E0APJ360 Applications
This resistor array excels in:
- Signal Conditioning: Precision voltage division in sensor interfaces and ADC/DAC circuits.
- Termination Networks: Bus line termination in high-speed digital systems (e.g., DDR memory, LVDS).
- Consumer Electronics: Space-saving solutions for smartphones, wearables, and IoT devices.
- Industrial Controls: PLC I/O modules and power supply feedback networks requiring stable resistance values.
Conclusion of MNR18E0APJ360
The MNR18E0APJ360 combines miniaturization, reliability, and versatility, making it a superior choice for modern electronics. Its isolated resistor design, low-profile package, and RoHS3 compliance cater to both high-performance and eco-conscious designs. Whether for consumer gadgets or industrial systems, this array delivers consistent performance while streamlining PCB layout complexity.



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