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MNR34J5ABJ621
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MNR34J5ABJ621 Description
MNR34J5ABJ621 Description
The MNR34J5ABJ621 from ROHM Semiconductor is a high-performance 4-resistor array designed for precision surface-mount applications. Packaged in a compact 2012 (5.20mm x 3.10mm) convex long-side terminal case, this device features isolated resistors with a 620Ω resistance and a ±5% tolerance, ensuring reliable performance in diverse circuit designs. With a ±200ppm/°C temperature coefficient and 125mW power rating per element, it delivers stable operation across a wide temperature range. Compliant with ROHS3 and REACH standards, it is ideal for environmentally conscious applications.
MNR34J5ABJ621 Features
- 4 isolated resistors in a single package, reducing board space and simplifying assembly.
- Low-profile design (0.026" height) suitable for space-constrained PCBs.
- 2012 package with convex long-side terminals for improved solder joint reliability.
- ±200ppm/°C temperature coefficient ensures minimal resistance drift under thermal stress.
- 125mW power dissipation per resistor for robust performance in high-density circuits.
- Moisture Sensitivity Level (MSL) 1 allows unlimited floor life, enhancing manufacturing flexibility.
MNR34J5ABJ621 Applications
This resistor array excels in precision analog and digital circuits, including:
- Voltage dividers and pull-up/pull-down networks in microcontrollers and sensors.
- Signal conditioning for ADCs, DACs, and communication interfaces.
- Industrial automation systems requiring stable resistance in harsh environments.
- Consumer electronics, such as smartphones and wearables, where compact size and reliability are critical.
Conclusion of MNR34J5ABJ621
The MNR34J5ABJ621 combines high density, thermal stability, and manufacturing efficiency, making it a superior choice for modern electronics. Its isolated resistor design, low thermal drift, and RoHS compliance position it as a versatile solution for both industrial and consumer applications. Engineers can leverage its compact footprint and robust performance to optimize circuit designs while reducing component count and assembly costs.



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