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RF064PJ364CS

RF064PJ364CS Description

The RF064PJ364CS by Samsung Electro-Mechanics is a high-performance 4-resistor array designed for precision surface-mount applications. Packaged in a compact 0502 (1406 Metric) long-side terminal case, it features a 360kΩ resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. With a 0.055" x 0.024" (1.40mm x 0.60mm) footprint and an ultra-low 0.013" (0.33mm) profile, this resistor network is ideal for space-constrained PCB designs. Its isolated circuit configuration and 31.25mW power rating per element make it suitable for high-density electronic assemblies.

RF064PJ364CS Features

• Compact & Low-Profile: 0502 package with long-side terminals for efficient PCB space utilization.
• Stable Performance: ±200ppm/°C temperature coefficient ensures minimal resistance drift.
• High Reliability: RoHS3 compliant, REACH unaffected, and MSL 1 (Unlimited) rated for extended shelf life.
• Surface-Mount Ready: Tape & reel (TR) packaging for automated assembly compatibility.
• Isolated Design: Independent resistors reduce crosstalk in multi-channel circuits.

RF064PJ364CS Applications

• Consumer Electronics: Signal conditioning in smartphones, wearables, and IoT devices.
• Industrial Controls: Precision voltage division in sensors and measurement equipment.
• Automotive Electronics: Compact resistor networks for infotainment and ADAS systems.
• Medical Devices: Low-noise circuits in portable diagnostic equipment.
• Telecom Infrastructure: Impedance matching in high-frequency RF modules.

Conclusion of RF064PJ364CS

The RF064PJ364CS stands out for its miniaturized form factor, robust performance, and industry-compliant certifications, making it a versatile choice for modern electronics. Its isolated resistor array design and wide operating tolerance cater to demanding applications where space and reliability are critical. Engineers can leverage this component to streamline designs while maintaining high signal integrity in compact, high-density layouts.