


Samsung Electro-Mechanics
RM062PJ181CS
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RM062PJ181CS Description
RM062PJ181CS Description
The RM062PJ181CS by Samsung Electro-Mechanics is a compact, high-performance 2-resistor array designed for surface-mount applications in modern electronics. Part of the RM series, this device features a 0302 (0805 Metric) package with long-side terminals, offering a 180Ω resistance per element with a ±5% tolerance. Its ultra-low profile (0.33mm max height) and miniature footprint (0.80mm x 0.60mm) make it ideal for space-constrained designs. The array operates with a ±200ppm/°C temperature coefficient, ensuring stable performance across varying thermal conditions. Compliant with ROHS3 and REACH standards, it is packaged in Tape & Reel (TR) for automated assembly efficiency.
RM062PJ181CS Features
- Dual-resistor isolated circuit: Provides two 180Ω resistors in a single package, reducing board space and component count.
- Low-profile design: 0.013" (0.33mm) seated height suits ultra-thin applications like wearables and mobile devices.
- Robust performance: ±200ppm/°C TCR and 31.25mW power rating per element ensure reliability in diverse environments.
- Automation-friendly: Tape & Reel packaging streamlines high-volume PCB assembly.
- Compliance: Meets ROHS3, REACH, and MSL1 (Unlimited) standards for environmental and handling resilience.
RM062PJ181CS Applications
This resistor array excels in:
- Consumer electronics: Smartphones, tablets, and IoT devices requiring miniaturized passive components.
- Signal conditioning: Voltage dividers, pull-up/pull-down networks in embedded systems.
- High-density PCBs: Where space optimization is critical (e.g., medical implants, drones).
- Automotive electronics: Non-critical circuits benefiting from its wide temperature stability.
Conclusion of RM062PJ181CS
The RM062PJ181CS combines miniaturization, performance, and manufacturing efficiency, making it a superior choice for modern electronic designs. Its dual-resistor isolation, low thermal drift, and compliance with stringent standards position it as a versatile solution for high-density, reliability-driven applications. Engineers prioritizing space savings and assembly scalability will find this component indispensable.



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