Silicon Motion_SM662GAC-BESS
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Silicon Motion
SM662GAC-BESS

774-SM662GAC-BESS
IC FLASH 160GBIT EMMC 100BGA
12 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
20G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
100-BGA (14x18)
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SM662GAC-BESS Description

SM662GAC-BESS Description

The SM662GAC-BESS is a high-performance memory IC designed by Silicon Motion, Inc., a leading provider of advanced memory solutions. This IC features a 160Gbit eMMC memory format, organized as 20G x 8, making it ideal for applications requiring substantial storage capacity in a compact form factor. The SM662GAC-BESS is packaged in a 100BGA format, suitable for surface mount applications, and is available in a tray package. It is classified under HTSUS code 8542.32.0071 and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours). This product is REACH unaffected and ROHS3 compliant, ensuring it meets the highest environmental and safety standards.

SM662GAC-BESS Features

  • Memory Size and Organization: The SM662GAC-BESS offers a substantial 160Gbit memory size, organized as 20G x 8, providing ample storage for data-intensive applications.
  • Memory Interface: Equipped with an eMMC interface, this IC ensures fast and reliable data transfer, making it suitable for high-speed applications.
  • Mounting Type: The surface mount technology (SMT) allows for efficient and reliable integration into modern electronic devices.
  • Environmental Compliance: The SM662GAC-BESS is REACH unaffected and ROHS3 compliant, ensuring it meets stringent environmental regulations and is suitable for global markets.
  • Moisture Sensitivity Level: With an MSL of 3 (168 Hours), this IC is designed to withstand harsh environmental conditions, ensuring long-term reliability and performance.
  • Packaging: Available in a tray package, the SM662GAC-BESS is easy to handle and integrate into production lines.

SM662GAC-BESS Applications

The SM662GAC-BESS is ideal for a wide range of applications where high-density storage and reliable performance are critical. Some specific use cases include:

  • Consumer Electronics: Ideal for smartphones, tablets, and other portable devices that require significant storage capacity in a compact form factor.
  • Industrial Applications: Suitable for industrial control systems and IoT devices where reliable data storage and fast data access are essential.
  • Embedded Systems: Perfect for embedded systems in automotive, aerospace, and medical industries where durability and performance are paramount.
  • Wearable Technology: Provides the necessary storage for smartwatches and fitness trackers, ensuring seamless operation and data storage.

Conclusion of SM662GAC-BESS

The SM662GAC-BESS from Silicon Motion, Inc. stands out as a robust and reliable memory IC, offering a 160Gbit eMMC memory format in a compact 100BGA package. Its surface mount technology, environmental compliance, and high moisture sensitivity level make it a versatile and durable solution for a variety of applications. Whether used in consumer electronics, industrial systems, or embedded devices, the SM662GAC-BESS delivers high performance and reliability, making it a top choice for engineers and designers in the electronics industry.

FAQ

What is the standard lead time for SM662GAC-BESS?
The standard lead time for SM662GAC-BESS is 12 Weeks.
What voltage specification is listed for SM662GAC-BESS?
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