Silicon Motion_SM662GEE BDSS
original

Silicon Motion
SM662GEE BDSS

774-SM662GEE BDSS
IC FLASH EMMC 153BGA
12 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
80G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
153-BGA (11.5x13)
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SM662GEE BDSS Description

SM662GEE BDSS Description

The SM662GEE BDSS is a high-performance eMMC memory IC chip manufactured by Silicon Motion, Inc. This advanced memory solution is designed for a wide range of applications that require reliable and efficient data storage. With a memory size of 640Gbit, organized as 80G x 8, the SM662GEE BDSS offers substantial storage capacity in a compact 153BGA package. The device is surface mountable, making it suitable for modern, space-constrained electronic designs. It is currently in an active product status, ensuring continued availability and support for customers.

SM662GEE BDSS Features

The SM662GEE BDSS features a robust set of technical specifications that set it apart from similar models. Key features include:

  • Memory Interface: Equipped with an eMMC interface, the SM662GEE BDSS provides a reliable and efficient connection for embedded systems.
  • Memory Organization: The 80G x 8 organization ensures optimal data management and retrieval, enhancing overall system performance.
  • Memory Size: With a total memory size of 640Gbit, this chip offers ample storage for complex applications, making it ideal for devices that require large data storage capabilities.
  • Mounting Type: Surface mount technology (SMT) is utilized, allowing for easy integration into compact and high-density PCB designs.
  • Package: The 153BGA package ensures a small footprint while maintaining high performance and reliability.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 Hours), the SM662GEE BDSS is suitable for a variety of manufacturing environments, ensuring durability and longevity.
  • Compliance: The chip is REACH unaffected and ROHS3 compliant, meeting stringent environmental and safety standards.

SM662GEE BDSS Applications

The SM662GEE BDSS is versatile and can be utilized in a variety of applications, including:

  • Consumer Electronics: Ideal for smartphones, tablets, and other portable devices that require high-density storage solutions.
  • Embedded Systems: Suitable for industrial and automotive applications where reliable and efficient data storage is critical.
  • IoT Devices: Provides robust storage capabilities for Internet of Things devices, ensuring data integrity and performance.
  • Wearable Technology: The compact design and high storage capacity make it perfect for wearable devices that need to store significant amounts of data.

Conclusion of SM662GEE BDSS

The SM662GEE BDSS from Silicon Motion, Inc. is a highly reliable and efficient eMMC memory IC chip. Its large memory size, compact package, and surface mount design make it an excellent choice for a wide range of applications. The chip's compliance with industry standards ensures that it meets the highest environmental and safety requirements. With its active product status and robust technical specifications, the SM662GEE BDSS is a standout solution for any application requiring high-density, reliable storage.

FAQ

What operating temperature range does SM662GEE BDSS support?
SM662GEE BDSS has an operating temperature range of -40°C ~ 85°C.
What is the mounting type of SM662GEE BDSS?
What is the standard lead time for SM662GEE BDSS?
Is SM662GEE BDSS currently in stock?
What package or case is SM662GEE BDSS available in?
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