Silicon Motion_SM662PAA-BESS
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Silicon Motion
SM662PAA-BESS

774-SM662PAA-BESS
IC FLASH 40GBIT EMMC 100BGA

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
5G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
100-BGA (14x18)
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SM662PAA-BESS Description

SM662PAA-BESS Description

The SM662PAA-BESS is a high-performance Memory IC Chip designed by Silicon Motion, Inc., a leading provider of advanced memory solutions. This IC features a 40Gbit eMMC memory format, organized as 5G x 8, and is packaged in a 100BGA form factor. The SM662PAA-BESS is designed for surface mount applications, ensuring compatibility with modern manufacturing processes and high-density board layouts. With a moisture sensitivity level (MSL) of 3 (168 hours), it is well-suited for environments where moisture resistance is critical.

SM662PAA-BESS Features

  • Memory Interface: The SM662PAA-BESS utilizes an eMMC interface, which is known for its high-speed data transfer capabilities and reliability. This interface is ideal for applications requiring fast read/write operations and efficient power management.
  • Memory Organization: The 5G x 8 memory organization ensures robust data storage and retrieval, making it suitable for applications that require large amounts of data to be processed quickly.
  • Memory Size: With a 40Gbit memory size, the SM662PAA-BESS offers substantial storage capacity, ideal for embedded systems and devices that require extensive data storage.
  • Mounting Type: The surface mount technology (SMT) used in the SM662PAA-BESS allows for compact and reliable integration into various electronic devices, reducing the overall footprint and enhancing durability.
  • Package: The 100BGA package provides a high-density and low-profile solution, making it suitable for space-constrained applications.
  • Compliance: The SM662PAA-BESS is REACH unaffected and ROHS3 compliant, ensuring it meets stringent environmental and safety standards.
  • Moisture Sensitivity Level: An MSL of 3 (168 hours) makes the SM662PAA-BESS suitable for applications in humid environments, ensuring long-term reliability and performance.

SM662PAA-BESS Applications

The SM662PAA-BESS is ideal for a wide range of applications, including:

  • Embedded Systems: Its high memory capacity and fast data transfer rates make it suitable for embedded systems that require large amounts of data storage and quick access.
  • Mobile Devices: The compact form factor and surface mount technology make it an excellent choice for mobile devices where space is at a premium.
  • IoT Devices: The SM662PAA-BESS can be used in IoT devices that require reliable and efficient data storage solutions.
  • Industrial Applications: The moisture sensitivity level of 3 (168 hours) makes it suitable for industrial applications where environmental conditions can be challenging.

Conclusion of SM662PAA-BESS

The SM662PAA-BESS from Silicon Motion, Inc., offers a combination of high memory capacity, fast data transfer rates, and reliable performance, making it a standout choice in the memory IC chip market. Its unique features, such as the eMMC interface and 5G x 8 memory organization, provide significant advantages over similar models. The SM662PAA-BESS is well-suited for a variety of applications, from embedded systems to mobile and IoT devices, ensuring it meets the demands of modern electronics. With its compliance to REACH and ROHS3 standards, the SM662PAA-BESS also ensures environmental responsibility and safety.

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