Silicon Motion_SM662PAB-BDS
original

Silicon Motion
SM662PAB-BDS

774-SM662PAB-BDS
PDF Datasheet
Ferri-eMMC BGA 153-b eMMC 5.1 TLC NAND automotive grad 32GB
12 weeks

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ISO9001
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ISO45001
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Tech Specifications

PCB changed
153
HTS
8542.32.00.71
ECCN (US)
EAR99
PPAP
Unknown
Automotive
Yes
Command Compatible
Yes
Supplier Package
BGA
Chip Density (bit)
256G
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SM662PAB-BDS Description

This electronic part puts Tray method in the first place. Packaging method of this SM662PAB-BDS aims to use on multiple product types and build brand identity. This SM662PAB-BDS is produced by this Silicon Motion and this manufacturer aims to provide original and genuine products to consumers. The vision of this Silicon Motion establishes a strong ability to deliver goods in stock and meet customers' needs for one-stop procurement. This SM662PAB-BDS is a member of Memory ICs Products category. It falls under the category of Memory IC Chips. Any integrated circuit with the capability to store bits of data in memory cells within a memory array. The main function of memory IC is the storing and retrieval of such electronic data. This SM662PAB-BDS is mainly applied in memory-based electronic devices such as mobile phones, computers, tablets, medical devices, smart cards, digital cameras, communication equipment, and other digital electronic devices.

FAQ

What is the mounting type of SM662PAB-BDS?
SM662PAB-BDS uses a Surface Mount mounting style based on the listed product specifications.
Are there related or alternative parts for SM662PAB-BDS?
What package or case is SM662PAB-BDS available in?
What is SM662PAB-BDS?
What is the standard lead time for SM662PAB-BDS?
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