Silicon Motion_SM662PBC BFSS
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Silicon Motion
SM662PBC BFSS

774-SM662PBC BFSS
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IC FLASH 160GBIT EMMC 153BGA
14 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 105°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
20G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
153-BGA (11.5x13)
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SM662PBC BFSS Description

SM662PBC BFSS Description

The SM662PBC BFSS is a high-performance eMMC memory IC chip designed by Silicon Motion, Inc. This advanced memory solution is engineered to meet the rigorous demands of modern electronic systems, offering a blend of high capacity, reliability, and efficiency. With a memory size of 160 Gbit (20G x 8 organization), the SM662PBC BFSS is packaged in a 153 BGA format, making it ideal for surface mount applications. The chip is RoHS3 compliant, ensuring environmental sustainability and adherence to industry standards.

SM662PBC BFSS Features

  • Memory Interface: The SM662PBC BFSS utilizes an eMMC interface, providing a robust and efficient connection for data transfer. This interface is widely adopted in the industry, ensuring compatibility with a variety of systems.
  • Memory Size and Organization: With a memory size of 160 Gbit (20G x 8), the SM662PBC BFSS offers substantial storage capacity. This large memory size is organized in a 20G x 8 format, allowing for efficient data management and retrieval.
  • Surface Mount Technology: The SM662PBC BFSS is designed for surface mount applications, making it suitable for compact and high-density electronic designs. This mounting type ensures reliable and durable connections.
  • Moisture Sensitivity Level: The chip has a moisture sensitivity level (MSL) of 3, with a 168-hour exposure limit. This feature ensures the chip's durability and reliability in various environmental conditions.
  • Compliance and Standards: The SM662PBC BFSS is RoHS3 compliant, adhering to stringent environmental and safety standards. This compliance ensures that the product is safe for use in a wide range of applications and meets global regulatory requirements.

SM662PBC BFSS Applications

The SM662PBC BFSS is ideal for a variety of applications where high memory capacity and reliability are crucial. Some specific use cases include:

  • Consumer Electronics: Ideal for smartphones, tablets, and other consumer devices that require high storage capacity and fast data access.
  • Industrial Systems: Suitable for industrial control systems, IoT devices, and embedded systems that demand robust and reliable memory solutions.
  • Automotive Applications: The chip's durability and reliability make it suitable for automotive infotainment systems and advanced driver-assistance systems (ADAS).
  • Medical Devices: The SM662PBC BFSS can be used in medical devices where data integrity and storage capacity are critical.

Conclusion of SM662PBC BFSS

The SM662PBC BFSS by Silicon Motion, Inc., stands out as a reliable and high-capacity memory IC chip. Its eMMC interface, large memory size, and surface mount design make it a versatile solution for various applications. The chip's RoHS3 compliance and moisture sensitivity level of 3 further enhance its reliability and durability. Whether used in consumer electronics, industrial systems, automotive applications, or medical devices, the SM662PBC BFSS offers a robust and efficient memory solution that meets the demands of modern electronic systems.

FAQ

What is SM662PBC BFSS?
SM662PBC BFSS is a Memory ICs Products from Silicon Motion. This product page provides its main specifications, pricing information, availability, and inquiry options.
What operating temperature range does SM662PBC BFSS support?
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