Silicon Motion_SM662PEC BFST
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Silicon Motion
SM662PEC BFST

774-SM662PEC BFST
PDF Datasheet
IC FLASH 512GBIT EMMC 153BGA
14 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
64G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
153-BGA (11.5x13)
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SM662PEC BFST Description

SM662PEC BFST Description

The SM662PEC BFST is a high-performance Memory IC Chip designed and manufactured by Silicon Motion, Inc. This device is a 512 Gbit eMMC (embedded MultiMediaCard) memory solution, featuring a 64G x 8 memory organization. It is packaged in a 153 BGA format, making it suitable for surface mount applications. The SM662PEC BFST is currently in an active product status, ensuring its availability and reliability for various electronic systems.

SM662PEC BFST Features

  • Memory Interface: The SM662PEC BFST utilizes an eMMC interface, which is widely recognized for its high-speed data transfer capabilities and compatibility with a broad range of embedded systems.
  • Memory Size: With a memory size of 512 Gbit, this chip offers substantial storage capacity, making it ideal for applications requiring large amounts of data storage.
  • Memory Organization: The 64G x 8 organization ensures efficient memory management and high-speed data access.
  • Mounting Type: Surface mount technology (SMT) allows for compact and reliable integration into modern electronic devices.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 Hours), the SM662PEC BFST is designed to withstand moderate levels of moisture exposure, enhancing its durability in various environmental conditions.
  • Compliance: The chip is RoHS3 compliant, adhering to stringent environmental regulations and ensuring its suitability for global markets.
  • REACH Status: The REACH status is vendor undefined, indicating that further information may be required for specific regulatory compliance.
  • ECCN: Classified under ECCN 3A991B1A, this product is subject to export controls, ensuring compliance with international trade regulations.
  • HTSUS: The Harmonized Tariff Schedule of the United States (HTSUS) code is 8542.32.0071, facilitating accurate customs classification and import procedures.

SM662PEC BFST Applications

The SM662PEC BFST is well-suited for a variety of applications where high-density storage and reliable performance are critical. Some specific use cases include:

  • Consumer Electronics: Ideal for smartphones, tablets, and other portable devices that require large storage capacities and fast data access.
  • Industrial Systems: Suitable for embedded systems in industrial environments, where compact size and robust performance are essential.
  • Automotive Electronics: Can be used in advanced driver-assistance systems (ADAS) and infotainment systems, providing reliable storage for critical data.
  • IoT Devices: Provides ample storage for IoT devices that need to handle large volumes of sensor data and software updates.

Conclusion of SM662PEC BFST

The SM662PEC BFST from Silicon Motion, Inc. stands out as a reliable and high-performance memory solution in the competitive landscape of Memory IC Chips. Its 512 Gbit eMMC interface, combined with a 64G x 8 memory organization, offers significant storage capacity and efficient data management. The surface mount technology and MSL 3 rating ensure its durability and compatibility with modern electronic systems. With its RoHS3 compliance and broad application potential, the SM662PEC BFST is an excellent choice for designers and engineers looking for a robust memory solution for their next project.

FAQ

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Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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