Silicon Motion_SM662PXE-BDSS
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Silicon Motion
SM662PXE-BDSS

774-SM662PXE-BDSS
IC FLASH 640GBIT EMMC 153BGA

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Tech Specifications

Operating Temperature
-25°C ~ 85°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
80G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
153-BGA (11.5x13)
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SM662PXE-BDSS Description

SM662PXE-BDSS Description

The SM662PXE-BDSS is a high-performance Memory IC Chip designed and manufactured by Silicon Motion, Inc. This product is an integral component in the realm of embedded storage solutions, offering a robust and reliable memory interface. The SM662PXE-BDSS features an eMMC memory interface, which is widely recognized for its efficiency and compatibility with various embedded systems. With a memory organization of 80G x 8, it provides a substantial storage capacity of 640Gbit, making it suitable for applications that require large data storage capabilities.

This Memory IC Chip is designed for surface mount technology, ensuring ease of integration into modern electronic devices. The product is housed in a 153BGA package, which is known for its compact size and high performance. The SM662PXE-BDSS is also RoHS3 compliant, adhering to stringent environmental standards and ensuring that it is suitable for use in a wide range of industries.

SM662PXE-BDSS Features

The SM662PXE-BDSS boasts several unique features that set it apart from similar models in the market:

  • Memory Interface: Equipped with an eMMC interface, the SM662PXE-BDSS ensures fast and efficient data transfer rates, making it ideal for applications that require high-speed data processing.
  • Memory Organization: The 80G x 8 memory organization provides a balanced approach to storage capacity and performance, ensuring that the chip can handle large volumes of data without compromising on speed.
  • Mounting Type: Surface mount technology ensures that the SM662PXE-BDSS can be easily integrated into compact and space-constrained electronic devices.
  • Memory Size: With a storage capacity of 640Gbit, the SM662PXE-BDSS offers ample space for data storage, making it suitable for applications that require extensive data handling.
  • Package: The 153BGA package is designed for high performance and durability, ensuring that the chip can withstand the rigors of industrial use.
  • RoHS3 Compliance: The SM662PXE-BDSS is RoHS3 compliant, ensuring that it meets the highest environmental standards and is suitable for use in a wide range of industries.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 Hours), the SM662PXE-BDSS is designed to withstand moisture exposure, making it suitable for use in environments with varying humidity levels.

SM662PXE-BDSS Applications

The SM662PXE-BDSS is ideal for a variety of applications, particularly those that require high storage capacity and fast data processing capabilities. Some specific use cases include:

  • Embedded Systems: The SM662PXE-BDSS is well-suited for use in embedded systems, such as industrial control systems, automotive electronics, and IoT devices, where reliable and efficient data storage is crucial.
  • Mobile Devices: Its compact size and high performance make it an excellent choice for mobile devices, including smartphones and tablets, where space is limited but storage capacity is essential.
  • Consumer Electronics: The SM662PXE-BDSS can be used in a variety of consumer electronics, such as digital cameras, media players, and smart home devices, providing a reliable and efficient storage solution.
  • Industrial Applications: The robust design and moisture resistance of the SM662PXE-BDSS make it suitable for industrial applications, such as manufacturing systems, robotics, and automation equipment, where durability and reliability are paramount.

Conclusion of SM662PXE-BDSS

In conclusion, the SM662PXE-BDSS is a high-performance Memory IC Chip that offers a unique combination of features and benefits. Its eMMC interface, 80G x 8 memory organization, and 640Gbit storage capacity make it an ideal choice for applications that require large data storage and fast data processing capabilities. The surface mount technology and 153BGA package ensure ease of integration into modern electronic devices, while its RoHS3 compliance and moisture resistance make it suitable for use in a wide range of industries. Whether used in embedded systems, mobile devices, consumer electronics, or industrial applications, the SM662PXE-BDSS provides a reliable and efficient storage solution that meets the demands of today's high-tech environment.

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