Silicon Motion_SM662PXE-BESS
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Silicon Motion
SM662PXE-BESS

774-SM662PXE-BESS
IC FLASH 640GBIT EMMC 100BGA
12 Weeks

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Tech Specifications

Operating Temperature
-25°C ~ 85°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
80G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
100-BGA (14x18)
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SM662PXE-BESS Description

SM662PXE-BESS Description

The SM662PXE-BESS is a high-performance Memory IC Chip designed by Silicon Motion, Inc., a leading provider of advanced memory solutions. This IC features a 640Gbit eMMC memory format, organized as 80G x 8, making it an ideal choice for applications requiring substantial storage capacity in a compact form factor. The device is packaged in a 100BGA format, ensuring efficient surface mount integration into modern electronic systems. With an ECCN classification of 3A991B1A and a HTSUS code of 8542.32.0071, the SM662PXE-BESS is compliant with international trade regulations. It is also REACH unaffected and RoHS3 compliant, ensuring it meets the highest environmental standards.

SM662PXE-BESS Features

The SM662PXE-BESS stands out with several unique features that provide significant advantages over similar models in the market. Key features include:

  • Memory Interface: The eMMC interface ensures reliable and high-speed data transfer, crucial for applications requiring rapid access to large datasets.
  • Memory Size: With a memory size of 640Gbit, the SM662PXE-BESS offers substantial storage capacity, making it suitable for high-density storage needs.
  • Memory Organization: The 80G x 8 organization provides a balanced approach to memory management, enhancing overall system performance.
  • Mounting Type: The surface mount technology (SMT) ensures robust integration into various electronic devices, minimizing the risk of mechanical failure.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 hours), the SM662PXE-BESS is designed to withstand moderate moisture exposure, ensuring reliability in diverse environmental conditions.
  • Package: The tray packaging ensures safe and efficient handling during manufacturing processes, reducing the risk of damage.

SM662PXE-BESS Applications

The SM662PXE-BESS is ideal for a wide range of applications where high-density storage and reliable performance are critical. Specific use cases include:

  • Consumer Electronics: Ideal for high-end smartphones, tablets, and digital cameras that require large storage capacities for multimedia content.
  • Industrial Systems: Suitable for embedded systems in industrial environments where robustness and reliability are paramount.
  • Automotive Applications: Perfect for in-vehicle infotainment systems and advanced driver assistance systems (ADAS) that demand high storage and fast data access.
  • IoT Devices: Ideal for smart home devices and IoT gateways that require significant storage for data logging and analytics.

Conclusion of SM662PXE-BESS

The SM662PXE-BESS by Silicon Motion, Inc., is a versatile and high-performance memory IC chip that offers significant advantages in terms of storage capacity, reliability, and environmental compliance. Its eMMC interface and 640Gbit memory size make it a superior choice for applications requiring large storage capacities and fast data access. The surface mount technology and tray packaging ensure ease of integration and handling, while its compliance with international standards ensures it meets the highest environmental and regulatory requirements. Whether for consumer electronics, industrial systems, automotive applications, or IoT devices, the SM662PXE-BESS is a reliable and efficient solution for modern electronic systems.

FAQ

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The standard lead time for SM662PXE-BESS is 12 Weeks.
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