Silicon Motion_SM671PXB-ADST
original

Silicon Motion
SM671PXB-ADST

774-SM671PXB-ADST
PDF Datasheet
FERRI-UFS BGA 153-B EMMC 3D TLC

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Tech Specifications

Operating Temperature
-25°C ~ 85°C
Memory Interface
UFS3.1
ECCN
3A991B1A
Memory Organization
32G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
153-BGA (11.5x13)
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SM671PXB-ADST Description

SM671PXB-ADST Description

The SM671PXB-ADST is a high-performance Memory IC Chip designed by Silicon Motion, Inc., a leading provider of advanced memory solutions. This chip is part of the FERRI-UFS BGA 153-B EMMC 3D TLC series, offering a robust and efficient memory solution for various electronic applications. The SM671PXB-ADST features a UFS3.1 memory interface, providing high-speed data transfer rates and enhanced performance. It is organized as 32G x 8, with a total memory size of 256Gbit, making it suitable for applications requiring large storage capacities.

The SM671PXB-ADST is packaged in a surface mount format, ensuring easy integration into compact and space-constrained designs. It is available in a tray package, facilitating efficient handling and storage during manufacturing processes. The chip is compliant with ROHS3 standards, ensuring environmental safety and regulatory compliance. Additionally, it has a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure to ambient conditions before assembly.

SM671PXB-ADST Features

  • Memory Interface: UFS3.1, delivering high-speed data transfer and improved performance over previous generations.
  • Memory Organization: 32G x 8, providing a balanced architecture for efficient memory management.
  • Memory Size: 256Gbit, offering substantial storage capacity for demanding applications.
  • Mounting Type: Surface Mount, enabling integration into compact and modern electronic designs.
  • Package: Tray, ensuring easy handling and storage during manufacturing.
  • RoHS Compliance: ROHS3 Compliant, meeting stringent environmental and regulatory standards.
  • Moisture Sensitivity Level (MSL): Level 3 (168 Hours), providing flexibility in manufacturing processes.
  • Memory Format: FLASH, ensuring non-volatile storage that retains data even without power.
  • ECCN: 3A991B1A, classifying the product under specific export control regulations.
  • HTSUS: 8523.51.0000, facilitating accurate customs classification for international trade.

SM671PXB-ADST Applications

The SM671PXB-ADST is ideal for a wide range of applications that require high-speed data processing and large storage capacities. Its UFS3.1 interface and 256Gbit memory size make it particularly suitable for:

  • Smartphones and Tablets: Providing fast and reliable storage for operating systems, applications, and multimedia content.
  • Digital Cameras and Camcorders: Enabling high-resolution image and video capture with quick data write speeds.
  • Wearable Devices: Offering compact and efficient storage solutions for fitness trackers, smartwatches, and other wearable technology.
  • Industrial Control Systems: Ensuring robust and reliable data storage for critical industrial applications.
  • Automotive Infotainment Systems: Delivering high-speed data transfer for navigation, entertainment, and advanced driver assistance systems.

Conclusion of SM671PXB-ADST

The SM671PXB-ADST from Silicon Motion, Inc. stands out as a high-performance memory solution with its UFS3.1 interface and 256Gbit storage capacity. Its surface mount design and tray packaging make it ideal for modern, compact electronic devices. The chip's compliance with ROHS3 standards and MSL 3 rating ensures environmental safety and manufacturing flexibility. While the product is currently marked as obsolete, its technical specifications and performance benefits make it a valuable component for applications requiring reliable and high-speed memory solutions.

FAQ

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