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RACF324DJT1K00

RACF324DJT1K00 Description

The RACF324DJT1K00 is a high-density, surface-mount resistor network from Stackpole Electronics Inc's RACF series. Designed for compact PCB layouts, this 4-resistor array features a 1kΩ resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient. Encased in a 2010 (5025 Metric) concave long-side terminal package, it measures 0.200" x 0.118" (5.08mm x 3.00mm) with a low-profile height of 0.028" (0.70mm). The isolated circuit configuration ensures independent resistor performance, while the 125mW power rating per element supports robust operation in demanding environments. Compliant with ROHS3 and REACH standards, it is ideal for automated assembly via tape-and-reel packaging.

RACF324DJT1K00 Features

• Compact Design: 2010 package with concave terminals for space-constrained applications.
• Stable Performance: ±200ppm/°C temperature coefficient ensures reliability across operating conditions.
• High Power Handling: 125mW per resistor for sustained performance in power-sensitive circuits.
• Automation-Friendly: Tape-and-reel packaging (TR) compatible with high-speed pick-and-place systems.
• Compliance: ROHS3 and REACH unaffected, meeting global environmental standards.
• Low Profile: 0.70mm seated height ideal for thin-profile devices.

RACF324DJT1K00 Applications

This resistor array excels in precision analog and digital circuits, including:

• Voltage Dividers: Stable resistance values ensure accurate signal conditioning.
• Termination Networks: Isolated resistors prevent crosstalk in high-speed data lines.
• Consumer Electronics: Compact size suits smartphones, tablets, and wearables.
• Industrial Controls: Robust tolerance (±5%) and power rating support harsh environments.
• Automotive Systems: REACH compliance aligns with automotive regulatory requirements.

Conclusion of RACF324DJT1K00

The RACF324DJT1K00 combines miniaturization, performance, and compliance, making it a versatile choice for modern electronics. Its isolated resistors, low thermal drift, and automation-ready packaging address challenges in high-density designs. While obsolete, its legacy as a reliable component in signal processing and power management endures. Engineers seeking a balance of precision and durability in resistor networks will find this model a proven solution.