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RACF324DZT0R00

RACF324DZT0R00 Description

The RACF324DZT0R00 from Stackpole Electronics, Inc. is a specialized 4-resistor array designed for high-density surface-mount applications. This zero-ohm jumper network, part of the RACF series, features a compact 2010 (5025 Metric) concave long-side terminal package with dimensions of 0.200" x 0.118" (5.08mm x 3.00mm) and a low-profile height of 0.028" (0.70mm). Its isolated circuit configuration ensures independent resistor functionality, while the 125mW power rating per element provides reliable performance in constrained spaces. Although marked as obsolete, it remains compliant with ROHS3 and REACH environmental standards, making it suitable for legacy designs requiring compliance.

RACF324DZT0R00 Features

• Zero-Ohm Jumper Configuration: Ideal for PCB trace routing or bridging connections without resistance interference.
• Compact 2010 Package: Concave long-side terminals enhance solder joint reliability in automated assembly.
• High-Density Design: Four isolated resistors in an ultra-thin 0.70mm profile for space-constrained applications.
• Robust Compliance: ROHS3 and REACH unaffected, with MSL 1 (Unlimited) moisture sensitivity for extended shelf life.
• Surface-Mount Ready: Compatible with standard reflow processes, backed by Tape & Reel (TR) packaging for high-volume production.

RACF324DZT0R00 Applications

This resistor array excels in:

• Signal Routing: Replaces PCB jumpers in high-density layouts, such as memory modules or FPGA/ASIC boards.
• Legacy System Maintenance: Supports repairs or upgrades in obsolete electronics where zero-ohm links are critical.
• Automated Assembly: Concave terminals and reel packaging optimize pick-and-place efficiency for consumer electronics and telecom hardware.
• Prototyping: Simplifies breadboard-to-PCB transitions with pre-configured zero-ohm paths.

Conclusion of RACF324DZT0R00

The RACF324DZT0R00 offers a niche solution for zero-ohm bridging in compact, compliance-driven designs. Its isolated resistors, low-profile form factor, and automation-friendly packaging make it a pragmatic choice for legacy or high-density applications. While obsolete, its environmental compliance and reliability ensure continued utility in specialized electronics. Engineers should evaluate alternative modern equivalents for new designs but can leverage this array for backward compatibility.