Stackpole Electronics, Inc. Tariff Inquiry

RACF408MJT220R

RACF408MJT220R Description

The RACF408MJT220R from Stackpole Electronics Inc is an 8-resistor bussed network array designed for high-density surface-mount applications. With a compact 1608 package (4.00mm x 2.10mm) and a low-profile height of 0.028" (0.70mm), this component is optimized for space-constrained PCB designs. Each resistor in the array features a 220Ω resistance with a ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The 62.5mW power rating per element and ROHS3 compliance make it suitable for modern, eco-conscious electronics. Although marked as obsolete, its REACH unaffected status and MSL 1 (Unlimited) moisture sensitivity ensure reliability in storage and assembly.

RACF408MJT220R Features

• High-Density Integration: 8 resistors in a concave, long-side terminal 1608 package, reducing board footprint.
• Stable Performance: ±200ppm/°C TCR and ±5% tolerance for consistent operation in temperature-sensitive applications.
• Surface-Mount Ready: Tape & Reel (TR) packaging enables automated assembly, improving manufacturing efficiency.
• Robust Compliance: ROHS3 and REACH compliant, meeting stringent environmental regulations.
• Bussed Circuit Design: Simplifies layout in pull-up/pull-down or termination networks, reducing discrete component count.

RACF408MJT220R Applications

Ideal for applications requiring compact, multi-resistor solutions, such as:

• Signal Conditioning: Pull-up/down networks in digital circuits (e.g., I²C, SPI).
• Voltage Division: Precision dividers in sensor interfaces or ADC circuits.
• Termination Arrays: Impedance matching in high-speed data lines (e.g., LVDS).
• Consumer Electronics: Space-saving designs in smartphones, wearables, and IoT devices.
• Industrial Controls: Durable, stable performance in PLCs and automation systems.

Conclusion of RACF408MJT220R

The RACF408MJT220R resistor network offers a balance of miniaturization, performance, and compliance, making it a pragmatic choice for legacy or low-volume designs. While obsolete, its bussed architecture and surface-mount compatibility remain advantageous for reducing BOM complexity. Engineers should evaluate alternative modern equivalents for high-volume production but can leverage this part for prototyping or niche applications where its specific attributes align with design requirements.