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RACF408MJT4K70

RACF408MJT4K70 Description

The RACF408MJT4K70 from Stackpole Electronics, Inc. is an 8-resistor bussed network array designed for high-density surface-mount applications. With a compact 1608 package (4.00mm x 2.10mm) and a low-profile height of 0.028" (0.70mm), this component is optimized for space-constrained PCB designs. Each resistor in the array features a 4.7kΩ resistance with a ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The 62.5mW power rating per element and ROHS3 compliance make it suitable for modern, eco-conscious electronics.

RACF408MJT4K70 Features

• High-Density Integration: 8 resistors in a compact 1608 package with concave, long-side terminals for reliable soldering.
• Stable Performance: Low ±200ppm/°C TCR and ±5% tolerance ensure consistent operation in temperature-sensitive applications.
• Surface-Mount Ready: Designed for automated assembly with Tape & Reel (TR) packaging, ideal for high-volume production.
• Robust Compliance: REACH unaffected and ROHS3 compliant, meeting stringent environmental regulations.
• Wide Operating Range: MSL 1 (Unlimited) moisture sensitivity allows extended shelf life and flexibility in handling.

RACF408MJT4K70 Applications

This resistor network excels in applications requiring precision and space efficiency, such as:

• Voltage Division Circuits: Ideal for sensor interfaces and ADC reference networks due to its bussed configuration.
• Consumer Electronics: Used in smartphones, tablets, and wearables where board space is critical.
• Industrial Control Systems: Reliable performance in PLCs and motor drivers, thanks to its stable TCR.
• Automotive Electronics: Suitable for infotainment and control modules, leveraging its robust construction.

Conclusion of RACF408MJT4K70

The RACF408MJT4K70 combines miniaturization, reliability, and compliance, making it a versatile choice for modern electronics. While marked as obsolete, its design advantages—such as low-profile mounting, stable TCR, and high-density integration—ensure it remains a practical solution for legacy or cost-sensitive projects. Engineers should evaluate replacement options for future-proof designs but can rely on this array for proven performance in existing applications.