Stackpole Electronics, Inc. Tariff Inquiry

RACF648RJT1K00

RACF648RJT1K00 Description

The RACF648RJT1K00 from Stackpole Electronics, Inc. is an 8-resistor bussed network array designed for high-density surface-mount applications. Housed in a compact 2512 (6432 Metric) concave long-side terminal package, it offers a 1kΩ resistance per element with a ±5% tolerance and ±200ppm/°C temperature coefficient. The device operates at 62.5mW power per resistor, ensuring reliable performance in low-power circuits. With dimensions of 6.40mm x 3.10mm (0.252" x 0.122") and a low-profile 0.70mm (0.028") seated height, it is optimized for space-constrained PCB designs. Though marked as obsolete, it remains ROHS3 compliant and REACH unaffected, making it suitable for legacy or low-risk environmental applications.

RACF648RJT1K00 Features

• High-Density Integration: 8 resistors in a single 10-pin package reduce PCB footprint and assembly complexity.
• Concave Long-Side Terminals: Enhances solder joint reliability and mechanical stability during mounting.
• Wide Operating Range: Stable performance across temperatures with a ±200ppm/°C coefficient.
• Low-Power Efficiency: 62.5mW per element ideal for signal conditioning and pull-up/down circuits.
• MSL1 (Unlimited): No baking required prior to reflow, simplifying storage and handling.
• Tape & Reel Packaging: Enables automated pick-and-place assembly for high-volume production.

RACF648RJT1K00 Applications

This resistor network excels in:

• Voltage Division & Current Limiting: Precision bussed networks for ADC/DAC interfaces.
• Pull-Up/Down Arrays: Simplifies biasing in microcontroller and FPGA designs.
• Legacy System Maintenance: Replacing discrete resistors in obsolete equipment.
• Consumer Electronics: Space-saving solution for TVs, routers, and IoT devices.
• Industrial Controls: Robust performance in PLCs and sensor modules.

Conclusion of RACF648RJT1K00

The RACF648RJT1K00 balances compactness, reliability, and cost-effectiveness for bussed resistor applications. Its concave terminal design and low-profile form factor address common PCB assembly challenges, while its ROHS3 compliance ensures adherence to modern environmental standards. Though discontinued, it remains a pragmatic choice for legacy designs or projects prioritizing proven performance over cutting-edge availability. Engineers should evaluate alternatives for new designs but can leverage this array for repairs or low-power analog circuits.