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RAVF104DJT13K0

RAVF104DJT13K0 Description

The RAVF104DJT13K0 from Stackpole Electronics, Inc. is a high-performance 4-resistor network in an ultra-compact 0804 package (2.00mm x 1.00mm) with a convex, long-side terminal design. Designed for surface-mount applications, this 13kΩ array offers ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. Each resistor in the isolated circuit delivers 62.5mW power dissipation, making it suitable for precision analog and digital circuits. Compliant with ROHS3 and REACH standards, it features an MSL 1 (Unlimited) rating for robust handling during assembly. Packaged in Tape & Reel (TR), it streamlines automated PCB production.

RAVF104DJT13K0 Features

• Space-Saving Design: 0.020" (0.50mm) height and 0804 footprint optimize board real estate in dense layouts.
• Reliable Performance: ±200ppm/°C TCR and ±5% tolerance ensure consistent resistance under thermal stress.
• High Power Handling: 62.5mW per element supports moderate power applications without derating concerns.
• Automation-Friendly: Tape & Reel packaging and 8-pin configuration enable efficient pick-and-place assembly.
• Environmental Compliance: ROHS3 and REACH unaffected, ideal for eco-conscious designs.

RAVF104DJT13K0 Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces (e.g., IoT devices).
• Pull-Up/Down Networks: Stable biasing for microcontrollers and logic circuits.
• Consumer Electronics: Space-constrained PCBs in wearables, smartphones, and tablets.
• Industrial Controls: Isolated resistor networks for PLCs and instrumentation.
• Automotive Electronics: Reliable performance in infotainment and ADAS modules (non-safety-critical).

Conclusion of RAVF104DJT13K0

The RAVF104DJT13K0 excels in miniaturized, high-reliability designs, combining low-profile packaging with stable electrical characteristics. Its isolated circuit topology and industry-standard compliance make it a versatile choice for modern electronics, particularly where board space and thermal stability are critical. Engineers can leverage its cost-effective, automation-ready design for scalable production across consumer, industrial, and automotive sectors.