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RAVF164DJT3K30

RAVF164DJT3K30 Description

The RAVF164DJT3K30 from Stackpole Electronics Inc is a high-performance 4-resistor array designed for precision surface-mount applications. This 1206 (3216 Metric) convex long-side terminal package offers a compact footprint of 0.126" x 0.063" (3.20mm x 1.60mm) with a low-profile height of 0.024" (0.60mm), making it ideal for space-constrained PCB designs. Each resistor in the array features a 3.3kΩ resistance with a ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The isolated circuit configuration allows for independent resistor operation, enhancing design flexibility.

RAVF164DJT3K30 Features

• 4 isolated resistors in a single 1206 package, reducing board space and assembly complexity.
• 100mW power rating per element, suitable for low-power signal conditioning and voltage division.
• ROHS3 compliant and REACH unaffected, meeting stringent environmental regulations.
• Moisture Sensitivity Level (MSL) 1, ensuring reliability in humid environments without baking requirements.
• Tape & Reel (TR) packaging, optimized for automated pick-and-place assembly processes.
• Convex, long-side terminal design improves solder joint reliability and mechanical stability.

RAVF164DJT3K30 Applications

This resistor array is particularly suited for:

• Signal termination and pull-up/pull-down networks in digital circuits (e.g., I²C, SPI).
• Voltage dividers and bias networks in analog sensor interfaces.
• Impedance matching in high-frequency communication modules.
• Consumer electronics, industrial controls, and automotive systems where space efficiency and reliability are critical.

Conclusion of RAVF164DJT3K30

The RAVF164DJT3K30 stands out for its compact design, robust performance, and versatility in modern electronics. Its isolated resistor configuration, low-profile package, and compliance with environmental standards make it a superior choice over discrete resistors or less optimized arrays. Ideal for high-density PCBs and automated manufacturing, this component delivers consistent performance in demanding applications while simplifying design and assembly workflows.