


Stackpole Electronics, Inc.
RAVF324DJT3K30
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RAVF324DJT3K30 Description
RAVF324DJT3K30 Description
The RAVF324DJT3K30 from Stackpole Electronics, Inc. is a high-performance 4-resistor array designed for precision surface-mount applications. This 3.3kΩ isolated network features a compact 2012 (0805 metric) convex long-side terminal package with dimensions of 5.08mm x 3.10mm (0.200" x 0.122") and a low-profile height of 0.65mm (0.026"). With a ±5% tolerance and ±200ppm/°C temperature coefficient, it delivers stable performance across industrial temperature ranges. The device is RoHS3 compliant, REACH unaffected, and rated for MSL 1 (unlimited shelf life), making it suitable for automated assembly processes. Packaged in Tape & Reel (TR), it aligns with high-volume production needs.
RAVF324DJT3K30 Features
- 4 isolated resistors in a single package, reducing board space and simplifying design.
- 125mW power rating per element, ensuring reliability in power-sensitive circuits.
- Convex long-side terminals for improved solder joint integrity and mechanical stability.
- Wide operating temperature range with low TCR (±200ppm/°C), ideal for harsh environments.
- 2012 (0805) footprint balances miniaturization with ease of handling during assembly.
- ROHS3/REACH compliance meets global environmental standards.
RAVF324DJT3K30 Applications
This resistor array excels in:
- Voltage division and pull-up/down networks in microcontrollers and FPGAs.
- Signal conditioning for sensors, ADCs, and DACs in industrial automation.
- Consumer electronics, such as smartphones and wearables, where space optimization is critical.
- Power management circuits requiring stable bias networks.
- Automotive electronics (non-safety-critical) due to its robust construction and tolerance to thermal stress.
Conclusion of RAVF324DJT3K30
The RAVF324DJT3K30 combines compactness, reliability, and ease of integration, making it a superior choice for modern PCB designs. Its isolated resistors, low TCR, and industry-standard compliance address the demands of high-density and high-reliability applications. Engineers can leverage this array to reduce component count, streamline assembly, and enhance performance in precision analog and digital circuits.



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