


Stackpole Electronics, Inc.
RAVF328RJT1K50
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RAVF328RJT1K50 Description
RAVF328RJT1K50 Description
The RAVF328RJT1K50 from Stackpole Electronics, Inc. is a high-performance 8-resistor bussed network designed for precision surface-mount applications. Encased in a compact 1206 (3216 Metric) convex package with long-side terminals, this array offers a 1.5kΩ resistance per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient. Its 62.5mW power rating per element ensures reliable operation in low-to-moderate power circuits. The device is RoHS3 compliant and adheres to REACH regulations, making it suitable for environmentally conscious designs. With a Moisture Sensitivity Level (MSL) of 1 (Unlimited), it is ideal for extended storage and handling.
RAVF328RJT1K50 Features
- Compact Design: Measures 0.126" x 0.063" (3.20mm x 1.60mm) with a low-profile height of 0.026" (0.65mm), saving PCB space.
- Bussed Circuit Configuration: Simplifies layout by connecting all resistors to a common node, reducing component count.
- High Reliability: ±200ppm/°C TCR ensures stable performance across temperature variations.
- Surface-Mount Ready: Tape & Reel (TR) packaging enables efficient automated assembly.
- Wide Compatibility: EAR99 and HTSUS 8533.21.0020 classifications facilitate global sourcing and integration.
RAVF328RJT1K50 Applications
This resistor array excels in:
- Voltage Division Circuits: Ideal for sensor interfaces and ADC reference networks.
- Pull-Up/Pull-Down Networks: Simplifies digital logic designs in microcontrollers and FPGAs.
- Consumer Electronics: Used in smartphones, tablets, and wearables for signal conditioning.
- Industrial Controls: Robust performance in PLCs, motor drives, and power management systems.
- Automotive Electronics: Suitable for infotainment and low-power ECU applications due to its reliability.
Conclusion of RAVF328RJT1K50
The RAVF328RJT1K50 stands out for its space-saving design, consistent performance, and ease of integration, making it a versatile choice for modern electronics. Its bussed architecture and robust specifications cater to both high-volume manufacturing and precision-critical applications. Engineers can leverage its low-profile form factor and compliance with environmental standards to enhance circuit reliability while minimizing footprint. A dependable solution for consumer, industrial, and automotive designs.



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