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AS21P2TLRQ
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AS21P2TLRQ Description
The AS21P2TLRQ is a high-performance, low-profile, surface-mount chip inductor from STMicroelectronics. It is designed for use in a wide range of applications, including power management, signal filtering, and high-frequency applications.
Description:
The AS21P2TLRQ is a shielded, surface-mount inductor with a compact, low-profile design. It features a high current capability and a low DC resistance, making it ideal for use in power management applications. The inductor is available in a 2220 size package, with an inductance value of 2.2 µH and a current rating of up to 3.2 A.
Features:
- High performance, low-profile surface-mount chip inductor
- Compact, shielded design for high-density applications
- High current capability and low DC resistance
- Wide operating temperature range (-55°C to +125°C)
- RoHS compliant
Applications:
The AS21P2TLRQ is suitable for a wide range of applications, including:
- Power management: The inductor's high current capability and low DC resistance make it ideal for use in power management circuits, such as DC-DC converters and power factor correction circuits.
- Signal filtering: The shielded design and low-profile package make the AS21P2TLRQ suitable for use in high-frequency signal filtering applications, such as RF and IF filters.
- Automotive applications: The wide operating temperature range and high reliability make the AS21P2TLRQ suitable for use in automotive applications, such as infotainment systems and power management circuits.
- Industrial applications: The inductor's high performance and robust design make it suitable for use in industrial applications, such as motor control circuits and power supplies.
In summary, the AS21P2TLRQ is a high-performance, low-profile, surface-mount chip inductor from STMicroelectronics. It offers a compact, shielded design with high current capability and low DC resistance, making it suitable for a wide range of applications, including power management, signal filtering, and high-frequency applications.



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