STMicroelectronics

M41T93SMY6F

M41T93SMY6F Description

The M41T93SMY6F from STMicroelectronics is a high-performance SPI-interface real-time clock (RTC) and calendar IC designed for precision timekeeping in embedded systems. Operating within a 3V to 5.5V supply range, it integrates a 7-byte SRAM for data storage and supports a 24-hour time format (HH:MM:SS:hh). With an ultra-low timekeeping current of 10µA (max) at 5.5V, it ensures minimal power consumption, making it ideal for battery-backed applications. The device is RoHS3 compliant and comes in an 18-SOX package, delivered in Tape & Reel (TR) for automated assembly.

M41T93SMY6F Features

• Clock/Calendar Functionality: Tracks time, date, and leap years with high accuracy.
• Advanced Features: Includes alarm functions, square wave output, and a watchdog timer for system reliability.
• Low Power Operation: 1.8V to 5.5V battery backup ensures uninterrupted timekeeping during power loss.
• SPI Interface: Enables fast and reliable communication with microcontrollers.
• Extended Temperature Range: Suitable for industrial environments.
• Integrated SRAM: 7-byte non-volatile memory for critical data storage.
• REACH Unaffected & MSL 1: Ensures compliance and long-term reliability.

M41T93SMY6F Applications

• Industrial Automation: Timestamping for data logging and event tracking.
• Consumer Electronics: Clocks in smart home devices, wearables, and appliances.
• Medical Devices: Accurate timekeeping for diagnostic equipment.
• Automotive Systems: Backup RTC for infotainment and telematics.
• Energy Metering: Time-based billing and power usage monitoring.

Conclusion of M41T93SMY6F

The M41T93SMY6F stands out for its low power consumption, robust feature set, and SPI interface, making it a versatile choice for applications requiring precise timekeeping. Its industrial-grade reliability, combined with battery backup support, ensures uninterrupted operation in critical systems. Whether for consumer, industrial, or automotive use, this RTC IC delivers performance and efficiency in a compact, surface-mount package.