STMicroelectronics_STM32F469BET6

STMicroelectronics
STM32F469BET6  
Microcontrollers

STMicroelectronics
STM32F469BET6
685-STM32F469BET6
Ersa
STMicroelectronics-STM32F469BET6-datasheets-9187900.pdf
IC MCU 32BIT 512KB FLASH 208LQFP
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    STM32F469BET6 Description

    STMicroelectronics' STM32F469BET6 is a high-performance microcontroller based on the 32-bit ARM Cortex-M7 core. It belongs to the STM32F469xx/479xx series, which is designed for a wide range of applications that require advanced processing capabilities, connectivity, and graphics performance.

    Description:

    The STM32F469BET6 is a system-in-package (SiP) microcontroller that integrates a high-performance ARM Cortex-M7 core running at up to 200 MHz, 2 MB of on-chip flash memory, and 320 KB of SRAM. It features a flexible clock system, allowing for various clock sources and configurations to optimize power consumption and performance.

    Features:

    1. ARM Cortex-M7 core with a maximum frequency of 200 MHz.
    2. 2 MB of on-chip flash memory and 320 KB of SRAM.
    3. Flexible clock system with various clock sources and configurations.
    4. Advanced graphics capabilities with a Chrom-ART™ Accelerator, 2D graphics hardware accelerator, and support for dual-channel LCD TFT controller.
    5. High-speed connectivity options, including USB OTG HS, 2x Ethernet MAC, and dual-mode Quad-SPI.
    6. Advanced communication interfaces, such as 6x I2C, 5x USART, 3x SPI, 2x CAN, and 2x SDIO.
    7. 3x 12-bit ADC with up to 18 channels and 2x 12-bit DAC.
    8. Advanced control features, including a PWM advanced timer, general-purpose timers, and real-time clock (RTC).
    9. Security features, such as a hardware cryptographic processor, secure boot, and tamper detection.
    10. Low-power modes and a power voltage range of 1.7 V to 3.6 V.

    Applications:

    The STM32F469BET6 is suitable for a wide range of applications that require high processing power, advanced graphics, and connectivity. Some of the key application areas include:

    1. Industrial automation and control systems.
    2. Human-machine interface (HMI) devices, such as touch panels and display controllers.
    3. Medical equipment, including imaging and diagnostic devices.
    4. Automotive infotainment systems and advanced driver-assistance systems (ADAS).
    5. Networking and communication devices, such as routers, switches, and gateways.
    6. High-end consumer electronics, including smart home devices and IoT applications.
    7. Robotics and drones, requiring advanced control and processing capabilities.
    8. Embedded vision systems, such as surveillance cameras and machine vision applications.
    9. Gaming consoles and arcade machines, benefiting from the advanced graphics capabilities.
    10. High-performance embedded systems, where low power consumption and high processing power are crucial.

    Tech Specifications

    Unit Weight
    Analog Supply Voltage
    PPAP
    Automotive
    Special Features
    RoHS
    EEPROM Size
    Instruction Set Architecture
    Core Architecture
    REACH Status
    Maximum Operating Supply Voltage (V)
    Maximum Clock Rate (MHz)
    PWM
    Supplier Temperature Grade
    DAC Channels
    Standard Package Name
    Oscillator Type
    Mounting
    Parallel Master Port
    USART
    Moisture Sensitive
    Typical Operating Supply Voltage (V)
    Package
    Data Converters
    Programmability
    ADC Channels
    Package Height
    Maximum Operating Temperature
    I2C
    Voltage - Supply (Vcc/Vdd)
    RoHS Status
    Maximum CPU Frequency (MHz)
    Data Bus Width
    USB
    Number of I/O
    Peripherals
    I2S
    Minimum Operating Temperature
    DAC Resolution
    Watchdog
    Part Status
    Number of I/Os
    Package Width
    Program Memory Type
    Data Bus Width (bit)
    Product Status
    SPI
    Supplier Package
    Tradename
    Package / Case
    Maximum Clock Frequency
    Family Name
    EU RoHS
    Data RAM Size
    Moisture Sensitivity Level (MSL)
    Core
    Operating Temperature
    ECCN
    Mounting Type
    Pin Count
    CAN
    Lead Shape
    Core Size
    Ethernet
    Connectivity
    Program Memory Size
    HTSUS
    Number of DACs
    USHTS
    Core Processor
    PCB changed
    HTS
    I/O Voltage
    ECCN (US)
    DAC Resolution (bit)
    Real Time Clock
    ADC Resolution
    Maximum Power Dissipation (mW)
    Device Core
    Supplier Device Package
    Supply Voltage - Min
    Minimum Operating Temperature (°C)
    Maximum Operating Temperature (°C)
    No. of Timers
    Mfr
    Supply Voltage - Max
    Interface Type
    Mounting Style
    Speed
    Number of ADCs
    RAM Size
    UART
    Package Length
    ADC Resolution (bit)
    Series
    Base Product Number
    Minimum Operating Supply Voltage (V)
    Supply Voltage Max Volt
    Operating Temperature (°C) (max)
    Supply Voltage Min Volt
    Operating Temperature (°C) (min)
    Grade
    ECCN (EU)
    RoHs compliant

    STM32F469BET6 Documents

    Download datasheets and manufacturer documentation for STM32F469BET6

    Ersa STM32F469xx Datasheet      
    Ersa STM32F469xx Datasheet      

    Shopping Guide

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