STMicroelectronics
TESEO-VIC3D

870-TESEO-VIC3D
PDF Datasheet
INDUSTRIAL GNSS DEAD RECKONING M
12 Weeks

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ISO9001
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ISO45001
ISO14001
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Tech Specifications

PCB changed
24
HTS
8542.39.00.60
Data Interface
I2C, UART
ECCN (US)
7A994
PPAP
No
Product Status
Active
Supplier Device Package
-
Automotive
No
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TESEO-VIC3D Description

With a vision to drive innovation and transform industries, the Tray in this TESEO-VIC3D plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. STMicroelectronics is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This STMicroelectronics TESEO-VIC3D falls into the RF Receivers which is a subset of RF and Wireless. This TESEO-VIC3D ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

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Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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