STMicroelectronics
TSV911AIYLT  
OP Amps, Buffer Amps ICs

STMicroelectronics
TSV911AIYLT
687-TSV911AIYLT
IC OPAMP GP 1 CIRCUIT SOT23-5
In Stock : 5252

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TSV911AIYLT Description

The TSV911AIYLT is a high-performance, low-power, single-chip solution for automotive camera applications, developed by STMicroelectronics. This chip is designed to meet the stringent requirements of the automotive industry, offering advanced image processing capabilities, high reliability, and robust performance in challenging environments.

Description:

The TSV911AIYLT is an advanced image signal processor (ISP) and video processor that integrates multiple functionalities to provide high-quality image processing for automotive cameras. It is designed to support various camera interfaces, including MIPI CSI-2, and can handle multiple camera inputs simultaneously. The chip is manufactured using a 28nm CMOS process, ensuring low power consumption and high performance.

Features:

  1. High Dynamic Range (HDR) support: The TSV911AIYLT offers advanced HDR processing, enabling the capture of clear images in challenging lighting conditions, such as in direct sunlight or during night driving.
  2. Lane Departure Warning (LDW) and Lane Keeping Assistance (LKA) support: The chip can process images to detect lane markings and provide warnings or assistance to the driver in maintaining their lane position.
  3. Traffic Sign Recognition (TSR): The TSV911AIYLT can identify and recognize various traffic signs, providing valuable information to the driver and assisting with navigation systems.
  4. Automatic Parking Assistance (APA) support: The chip can process images to assist with parking maneuvers, making parallel and perpendicular parking easier and safer.
  5. Surround View System (SVS) support: The TSV911AIYLT can stitch together images from multiple cameras to provide a 360-degree view around the vehicle, enhancing situational awareness and safety.
  6. Low-light performance: The chip is designed to deliver excellent image quality in low-light conditions, ensuring clear and detailed images even in challenging environments.
  7. Scalable and flexible architecture: The TSV911AIYLT can support various resolutions and camera configurations, making it suitable for a wide range of automotive camera applications.
  8. Compliance with automotive standards: The chip meets the stringent requirements of the automotive industry, including AEC-Q100 and AEC-Q200 standards, ensuring high reliability and robust performance.

Applications:

  1. Rear-view cameras: The TSV911AIYLT can be used in rear-view camera systems to provide clear and detailed images for safer reversing and parking.
  2. Surround view cameras: The chip can be employed in surround view camera systems to offer a complete 360-degree view around the vehicle, enhancing safety and situational awareness.
  3. Advanced Driver Assistance Systems (ADAS): The TSV911AIYLT can be integrated into ADAS to support features such as LDW, LKA, and TSR, providing valuable assistance to drivers and improving overall vehicle safety.
  4. In-cabin monitoring: The chip can be used for in-cabin monitoring applications, such as driver drowsiness detection or occupant classification, to enhance passenger safety and comfort.
  5. Autonomous driving: The TSV911AIYLT can be utilized in autonomous driving systems to process and analyze images from various cameras, contributing to the development of self-driving vehicles.

In summary, the TSV911AIYLT from STMicroelectronics is a powerful and versatile image signal processor designed for automotive camera applications. Its advanced features, such as HDR support, LDW, LKA, and TSR, make it an ideal choice for a wide range of automotive applications, from rear-view cameras to advanced driver assistance systems and autonomous driving.

Tech Specifications

Voltage - Supply Span (Max)
Number of Channels per Chip
Power Supply Type
Maximum Input Offset Voltage (mV)
Typical Output Current (mA)
PPAP
Gain Bandwidth Product
Product Status
Current - Input Bias
Automotive
Maximum Input Offset Current (uA)
Rail to Rail
Supplier Package
Package / Case
Typical Voltage Gain (dB)
REACH Status
EU RoHS
Amplifier Type
Moisture Sensitivity Level (MSL)
Typical Input Noise Voltage Density (nV/rtHz)
Operating Temperature
Typical Slew Rate (V/us)
ECCN
Grade
Supplier Temperature Grade
Mounting Type
Current - Supply
Standard Package Name
Pin Count
Shut Down Support
Mounting
Qualification
Minimum Single Supply Voltage (V)
Voltage - Supply Span (Min)
Lead Shape
Manufacturer Type
HTSUS
Package
Current - Output / Channel
Minimum CMRR (dB)
Maximum Quiescent Current (mA)
PCB changed
Output Type
HTS
ECCN (US)
Supplier Device Package
Minimum CMRR Range (dB)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Typical Gain Bandwidth Product (MHz)
Package Height
Mfr
RoHS Status
Maximum Input Bias Current (uA)
Slew Rate
Package Length
Series
Type
Maximum Single Supply Voltage (V)
Part Status
Number of Circuits
Package Width
Base Product Number
Unit Weight
en - Input Voltage Noise Density
Vos - Input Offset Voltage
Product
RoHS
Supply Voltage - Min
Operating Supply Current
SR - Slew Rate
Number of Channels
Maximum Operating Temperature
Ib - Input Bias Current
Supply Voltage - Max
Mounting Style
Minimum Operating Temperature
CMRR - Common Mode Rejection Ratio
Shutdown
Operating Supply Voltage
Output Current per Channel
Supply Type
USHTS
GBP - Gain Bandwidth Product

TSV911AIYLT Documents

Download datasheets and manufacturer documentation for TSV911AIYLT

Ersa New Lead-Frame 01/Sep/2020      
Ersa TSV91x(A)      
Ersa Box Label Chg 28/Jul/2016       Moisture Barrier Bag 09/May/2016      

Shopping Guide

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Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
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