TE Connectivity

SIL09E561J

SIL09E561J Description

The SIL09E561J from TE Connectivity Passive Product is an 8-resistor bussed network housed in a compact 9-pin SIP (Single In-Line Package). Designed for through-hole mounting, this resistor array offers a resistance value of 560Ω per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The device operates at 200mW power per element and features a bussed circuit type, simplifying PCB layout and reducing component count. With dimensions of 0.900" x 0.098" (22.86mm x 2.50mm) and a seated height of 0.200" (5.08mm), it is suitable for space-constrained applications. The Moisture Sensitivity Level (MSL) 1 rating ensures reliability in humid environments, while the EAR99 ECCN classification facilitates global compliance.

SIL09E561J Features

• High-Density Integration: Combines 8 resistors in a single 9-pin SIP, reducing PCB footprint.
• Stable Performance: ±200ppm/°C temperature coefficient ensures minimal resistance drift.
• Robust Construction: Through-hole design enhances mechanical durability.
• Wide Compatibility: Bussed configuration simplifies circuit design for voltage division or pull-up/down applications.
• Reliable MSL Rating: MSL 1 (Unlimited) allows extended shelf life and handling flexibility.
• Industry-Standard Compliance: Meets HTSUS 8533.21.0050 and REACH (vendor-defined) requirements.

SIL09E561J Applications

• Voltage Division Circuits: Ideal for precision analog signal conditioning in sensor interfaces.
• Pull-Up/Pull-Down Networks: Used in digital logic circuits to stabilize signal lines.
• Industrial Control Systems: Suitable for harsh environments due to robust construction.
• Consumer Electronics: Space-saving solution for compact devices like set-top boxes or IoT modules.
• Automotive Electronics: Reliable performance in temperature-varying applications (non-safety-critical).

Conclusion of SIL09E561J

The SIL09E561J resistor network stands out for its compact design, stable performance, and ease of integration, making it a versatile choice for engineers seeking reliability in analog or digital circuits. Its bussed architecture reduces design complexity, while the through-hole mounting ensures durability. Whether for industrial, automotive, or consumer electronics, this component delivers consistent performance with minimal footprint, backed by TE Connectivity’s quality assurance.