TechNexion_PICOHS06M2T2020150KIT
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TechNexion
PICOHS06M2T2020150KIT

219-PICOHS06M2T2020150KIT
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
3 Weeks

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
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Tech Specifications

Length
41 mm
ECCN
EAR99
Product
Heat Sink Kits
Height
6 mm
USHTS
8473305100
Width
37 mm
Designed for
NXP i.MX6 UL/ULL
RoHS
RoHS Compliant

PICOHS06M2T2020150KIT Description

Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7

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PICOHS06M2T2020150KIT is a Heat Sinks from TechNexion. This product page provides its main specifications, pricing information, availability, and inquiry options.
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