Texas Instruments_66AK2E05XABD25
original

Texas Instruments
66AK2E05XABD25

698-66AK2E05XABD25
PDF Datasheet
Multicore DSP+Arm, 4x Arm A15 cores, 1x C66x DSP core, NetCP, 10GbE switch 1089-FCBGA 0 to 85
12 Weeks

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Tech Specifications

Max Operating Temperature
85
Number of Terminals
1089
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B1089
Width
27
Length
27
Temperature Grade
OTHER
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66AK2E05XABD25 Description

66AK2E05XABD25 Description

The 66AK2E05XABD25 is a high-performance, multicore DSP+ARM® System on Chip (SoC) from Texas Instruments, part of the 66AK2E0x KeyStone Multicore series. This IC is designed for demanding embedded applications requiring robust processing capabilities and efficient power management. It operates within a temperature range of 0°C to 85°C, making it suitable for industrial and commercial environments. The device features a clock rate of 1.25GHz, ensuring fast and efficient processing. It is available in a Surface Mount package, specifically a 1089FCBGA, which is ideal for compact and high-density designs. The 66AK2E05XABD25 includes 256kB of ROM and 2MB of on-chip RAM, providing ample storage for embedded applications. It supports a variety of I/O voltages, including 1.35V, 1.5V, 1.8V, and 3.3V, and has a variable core voltage for optimized power consumption. The device is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards. It also has a Moisture Sensitivity Level (MSL) of 4, allowing for a 72-hour exposure period before assembly.

66AK2E05XABD25 Features

The 66AK2E05XABD25 offers several unique features that set it apart from similar models. It integrates a powerful DSP and ARM® processor, enabling efficient handling of both general-purpose computing tasks and complex signal processing requirements. The inclusion of Error-Correcting Code (ECC) ensures data integrity and reliability, crucial for mission-critical applications. The SoC supports a wide range of interfaces, including EBI/EMI, Ethernet, DMA, I2C, MDIO, PCIe, TSIP, SPI, UART/USART, USB 3.0, and USIM, providing extensive connectivity options. This versatility makes it suitable for a variety of applications, from industrial automation to advanced communication systems. The device is classified under ECCN 5A002A1 TI and HTSUS 8542.31.0001, indicating its compliance with international trade regulations.

66AK2E05XABD25 Applications

The 66AK2E05XABD25 is ideal for applications requiring high computational power and efficient power management. Its multicore architecture makes it suitable for complex signal processing tasks, such as in radar systems, sonar systems, and digital communication equipment. The extensive interface options allow it to be integrated into various systems, including industrial control panels, medical imaging devices, and advanced networking equipment. The ability to operate within a wide temperature range and its robust environmental compliance make it a reliable choice for both indoor and outdoor applications. Its compact Surface Mount package also makes it suitable for space-constrained designs, such as in portable devices and embedded systems.

Conclusion of 66AK2E05XABD25

The 66AK2E05XABD25 from Texas Instruments is a versatile and powerful SoC that combines the strengths of a DSP and ARM® processor. Its high clock rate, extensive memory options, and wide range of interfaces make it suitable for a variety of demanding applications. The device's compliance with environmental and safety standards, along with its robust temperature range and moisture sensitivity level, ensures it is reliable and durable. Whether used in industrial automation, medical equipment, or advanced communication systems, the 66AK2E05XABD25 offers a reliable and efficient solution for embedded applications.

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The standard lead time for 66AK2E05XABD25 is 12 Weeks.
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